Publikationen pro Jahr
Publikationen pro Jahr
- 7 Ergebnisse
Suchergebnisse
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2023
3D modeling of inductive and capacitive coupling between surface-mounted multilayer-capacitors
Riener, C. M., Bauernfeind, T., Baumgartner, P., Hackl, H., Ibel, M. G., Kvasnicka, S., Prestros, R., Roppert, K. & Kaltenbacher, M., 1 Mai 2023, in: International Journal of Numerical Modelling. 36, 3, S. 1-20 e3046.Publikation: Beitrag in einer Fachzeitschrift › Artikel › Begutachtung
Open Access -
2021
3D Modelling of Inductive and Capacitive Coupling Between Surface-Mounted Multi-Layer-Capacitors
Riener, C. M., Bauernfeind, T., Baumgartner, P., Hackl, H., Ibel, M. G., Kvasnicka, S., Prestros, R., Roppert, K. & Kaltenbacher, M., Juli 2021, Selected Abstracts of the 12th International Symposium on Electric and Magnetic Fields.Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung
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Extraction of Single Cell Impedance from within a Battery Pack by Virtual De-Embedding: A Proof of Concept
Hackl, H., Ibel, M., Mologni, J., Pommerenke, D. J. & Auinger, B., 26 Juli 2021, 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. Institute of Electrical and Electronics Engineers, S. 815-819 5 S. (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021).Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung
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Li-Ion Cell Impedance Measurement Using Open/Short/Load Compensation for De-Embedding
Hackl, H., Ibel, M., Landinger, T. F., Pommerenke, D. J. & Auinger, B., 26 Juli 2021, 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021. IEEE Publications, S. 190-195 6 S. 9559223. (2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021).Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung
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2019
Comparison of BBSPICE to PEEC Equivalent Circuit Models for Simulation of Floating PCB above Ground Plane
Hackl, H., Ibel, M., Auinger, B., Stockreiter, C. & Deutschmann, B., 1 Sept. 2019, 2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE. Institute of Electrical and Electronics Engineers, S. 19-24 6 S. 8872031. (EMC Europe 2019 - 2019 International Symposium on Electromagnetic Compatibility).Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung
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Semi-Automatic Generation of Lumped Element Transmission Line Circuits from 2D Cross Section
Ibel, M. G., Hackl, H., Auinger, B., Stockreiter, C. & Deutschmann, B., 27 Feb. 2019. 1 S.Publikation: Konferenzbeitrag › Poster › Begutachtung
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Survey on the generation of equivalent circuit cable models for transient simulation
Ibel, M., Hackl, H., Auinger, B., Stockreiter, C. & Deutschmann, B., 1 Mai 2019, 2019 42nd International Convention on Information and Communication Technology, Electronics and Microelectronics, MIPRO 2019 - Proceedings. Skala, K., Car, Z., Pale, P., Huljenic, D., Janjic, M., Koricic, M., Sruk, V., Ribaric, S., Grbac, T. G., Butkovic, Z., Cicin-Sain, M., Skvorc, D., Mauher, M., Babic, S., Gros, S., Vrdoljak, B. & Tijan, E. (Hrsg.). Institute of Electrical and Electronics Engineers, S. 102-107 6 S. 8757048. (2019 42nd International Convention on Information and Communication Technology, Electronics and Microelectronics, MIPRO 2019 - Proceedings).Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung