A Novel 3D Packaging Concept for RF Powered Sensor Grains

Walther Pachler; Klaus Pressel; Jasmin Grosinger; Gottfried Beer; Wolfgang Bösch; Gerald Holweg; Christian Zilch; Manfred Meindl

doi:10.1109/ECTC.2014.6897440

A Novel 3D Packaging Concept for RF Powered Sensor Grains

Walther Pachler, Klaus Pressel, Jasmin Grosinger, Gottfried Beer, Wolfgang Bösch, Gerald Holweg, Christian Zilch, Manfred Meindl

Institut für Hochfrequenztechnik (4510)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Originalsprache	englisch
Titel	IEEE 64th Electronic Components and Technology Conference
Herausgeber (Verlag)	Institute of Electrical and Electronics Engineers
Seiten	1183-1188
DOIs	https://doi.org/10.1109/ECTC.2014.6897440
Publikationsstatus	Veröffentlicht - 2014
Veranstaltung	IEEE Electronic Components and Technology Conference - Orlando, USA / Vereinigte Staaten Dauer: 27 Mai 2014 → 30 Mai 2014

Konferenz

Konferenz	IEEE Electronic Components and Technology Conference
Land/Gebiet	USA / Vereinigte Staaten
Ort	Orlando
Zeitraum	27/05/14 → 30/05/14

Fields of Expertise

Information, Communication & Computing

Treatment code (Nähere Zuordnung)

Experimental
Application

Zugriff auf Dokument

10.1109/ECTC.2014.6897440

Andere Dateien und Links

1 Abgeschlossen
2 Laufend

Radio Frequenz Identifikation (RFID) Technologie
Görtschacher, L. J., Pachler, W., Freidl, P. F., Bösch, W., Gadringer, M. E., Khan, H. N., Greiner, P., Glanzer, C., Grosinger, J., Fischbacher, R. B., Deutschmann, B., Romero Lopera, J. & Shetty, D.
1/04/13 → …
Projekt: Arbeitsgebiet
Wireless Power Transmission for Sustainable Electronics (WIPE)
Bösch, W., Görtschacher, L. J., Pachler, W., Freidl, P. F., Khan, H. N., Gadringer, M. E., Greiner, P., Gentili, F., Glanzer, C., Grosinger, J., Fischbacher, R. B., Deutschmann, B., Shetty, D. & Romero Lopera, J.
1/04/13 → …
Projekt: Arbeitsgebiet
SeCoS - Verbundene Welt [Original in Englisch: Secure Contactless Sphere Smart RFID-Technologies for a Connected World]
Bösch, W., Wenger, E., Khan, H. N., Schmidt, J., Gadringer, M. E., Spreitzer, R. C., Mendel, F., Gruss, D., Hutter, M., Freidl, P. F., Görtschacher, L. J., Mangard, S. & Grosinger, J.
1/01/13 → 31/12/15
Projekt: Forschungsprojekt

1 Invited talk bei Konferenz oder Fachtagung

RF Design for Ultra-Low-Power Wireless Communication Systems
Jasmin Grosinger (Keynote speaker)
12 Sept. 2023
Aktivität: Vortrag oder Präsentation › Invited talk bei Konferenz oder Fachtagung › Science to science

Dieses zitieren

Pachler, W, Pressel, K, Grosinger, J, Beer, G, Bösch, W, Holweg, G, Zilch, C & Meindl, M 2014, A Novel 3D Packaging Concept for RF Powered Sensor Grains. in IEEE 64th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers, S. 1183-1188, IEEE Electronic Components and Technology Conference, Orlando, USA / Vereinigte Staaten, 27/05/14. https://doi.org/10.1109/ECTC.2014.6897440

@inproceedings{63f3e4def6dd4f90a627843f2725eea5,

title = "A Novel 3D Packaging Concept for RF Powered Sensor Grains",

author = "Walther Pachler and Klaus Pressel and Jasmin Grosinger and Gottfried Beer and Wolfgang B{\"o}sch and Gerald Holweg and Christian Zilch and Manfred Meindl",

year = "2014",

doi = "10.1109/ECTC.2014.6897440",

language = "English",

pages = "1183--1188",

booktitle = "IEEE 64th Electronic Components and Technology Conference",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "IEEE Electronic Components and Technology Conference ; Conference date: 27-05-2014 Through 30-05-2014",

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TY - GEN

T1 - A Novel 3D Packaging Concept for RF Powered Sensor Grains

AU - Pachler, Walther

AU - Pressel, Klaus

AU - Grosinger, Jasmin

AU - Beer, Gottfried

AU - Bösch, Wolfgang

AU - Holweg, Gerald

AU - Zilch, Christian

AU - Meindl, Manfred

PY - 2014

Y1 - 2014

UR - http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6884273

UR - http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6897440

U2 - 10.1109/ECTC.2014.6897440

DO - 10.1109/ECTC.2014.6897440

M3 - Conference paper

SP - 1183

EP - 1188

BT - IEEE 64th Electronic Components and Technology Conference

PB - Institute of Electrical and Electronics Engineers

T2 - IEEE Electronic Components and Technology Conference

Y2 - 27 May 2014 through 30 May 2014

ER -

A Novel 3D Packaging Concept for RF Powered Sensor Grains

Konferenz

Fields of Expertise

Treatment code (Nähere Zuordnung)

Zugriff auf Dokument

Andere Dateien und Links

Projekte

Radio Frequenz Identifikation (RFID) Technologie

Wireless Power Transmission for Sustainable Electronics (WIPE)

SeCoS - Verbundene Welt [Original in Englisch: Secure Contactless Sphere Smart RFID-Technologies for a Connected World]

Aktivitäten

RF Design for Ultra-Low-Power Wireless Communication Systems

Dieses zitieren