Broadband Modeling of Mutual Coupling between Surface-Mounted Devices

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandBegutachtung

Abstract

Electromagnetic interference (EMI) is a fundamental challenge in electronic systems. The use of filter structures, in-cluding surface-mounted (SMT) passive components, is essential to ensure the reliable operation of such systems. However, these devices are susceptible to parasitic coupling effects when placed in close proximity, leading to changes in their electromagnetic (EM) behaviour and potential EMI problems at a particular frequency range. This paper investigates the effects of different package sizes and placements on the EM coupling between devices using 3D fullwave finite element (FE) simulations and experimental measurements. Finally, an equivalent circuit model is derived from the FE simulation results that can be used in computationally more expensive EM-Co system simulations to account for these coupling mechanisms.

Originalspracheenglisch
Titel2024 International Applied Computational Electromagnetics Society Symposium, ACES 2024
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
Seitenumfang2
ISBN (elektronisch)9781733509671
PublikationsstatusVeröffentlicht - 2024
Veranstaltung2024 International Applied Computational Electromagnetics Society Symposium: ACES 2024 - Orlando, USA / Vereinigte Staaten
Dauer: 19 Mai 202422 Mai 2024

Konferenz

Konferenz2024 International Applied Computational Electromagnetics Society Symposium
KurztitelACES 2024
Land/GebietUSA / Vereinigte Staaten
OrtOrlando
Zeitraum19/05/2422/05/24

ASJC Scopus subject areas

  • Computational Mathematics
  • Mathematische Physik
  • Instrumentierung
  • Strahlung

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