Characterising Soft-Failures in Component-Level ESD Testing

Patrick Schrey

doi:10.1109/PRIME.2018.8430342

Characterising Soft-Failures in Component-Level ESD Testing

Patrick Schrey

Institut für Elektronik (4390)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Originalsprache	englisch
Titel	2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)
Herausgeber (Verlag)	IEEE Xplore
Seiten	93-96
Seitenumfang	4
ISBN (elektronisch)	978-1-5386-5387-6
DOIs	https://doi.org/10.1109/PRIME.2018.8430342
Publikationsstatus	Veröffentlicht - Juli 2018
Veranstaltung	14th Conference on Ph.D. Research in Microelectronics and Electronics: PRIME 2018 - Faculty of Nuclear Sciences and Physical Engineering, Czech Technical University in Prague Brehova 7, Prague 1, Czech Republic, Prague, Slowakei Dauer: 2 Juli 2018 → 5 Juli 2018 Konferenznummer: 14

Konferenz

Konferenz	14th Conference on Ph.D. Research in Microelectronics and Electronics
Kurztitel	PRIME 2018
Land/Gebiet	Slowakei
Ort	Prague
Zeitraum	2/07/18 → 5/07/18

Zugriff auf Dokument

10.1109/PRIME.2018.8430342

1 Konferenz oder Fachtagung (Teilnahme an/Organisation von)
1 Vortrag bei Konferenz oder Fachtagung

14th Conference on Ph.D. Research in Microelectronics and Electronics
Patrick Schrey (Teilnehmer/-in)
2 Juli 2018 → 5 Juli 2018
Aktivität: Teilnahme an / Organisation von › Konferenz oder Fachtagung (Teilnahme an/Organisation von)
Characterising Soft-Failures in Component-Level ESD Testing
Patrick Schrey (Redner/in)
3 Juli 2018
Aktivität: Vortrag oder Präsentation › Vortrag bei Konferenz oder Fachtagung › Science to science

Dieses zitieren

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title = "Characterising Soft-Failures in Component-Level ESD Testing",

author = "Patrick Schrey",

year = "2018",

month = jul,

doi = "10.1109/PRIME.2018.8430342",

language = "English",

pages = "93--96",

booktitle = "2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)",

publisher = "IEEE Xplore",

note = "14th Conference on Ph.D. Research in Microelectronics and Electronics, PRIME 2018 : PRIME 2018, PRIME 2018 ; Conference date: 02-07-2018 Through 05-07-2018",

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TY - GEN

T1 - Characterising Soft-Failures in Component-Level ESD Testing

AU - Schrey, Patrick

N1 - Conference code: 14

PY - 2018/7

Y1 - 2018/7

U2 - 10.1109/PRIME.2018.8430342

DO - 10.1109/PRIME.2018.8430342

M3 - Conference paper

SP - 93

EP - 96

BT - 2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)

PB - IEEE Xplore

T2 - 14th Conference on Ph.D. Research in Microelectronics and Electronics, PRIME 2018

Y2 - 2 July 2018 through 5 July 2018

ER -

Characterising Soft-Failures in Component-Level ESD Testing

Konferenz

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Aktivitäten

14th Conference on Ph.D. Research in Microelectronics and Electronics

Characterising Soft-Failures in Component-Level ESD Testing

Dieses zitieren