Characterization of Moisture Uptake in Microelectronics Packaging Materials

Fabian Huber; Harald Etschmaier; Archim Wolfberger; Anderson Singulani; Peter Hadley

doi:10.1109/ESTC.2018.8546489

Characterization of Moisture Uptake in Microelectronics Packaging Materials

Fabian Huber, Harald Etschmaier, Archim Wolfberger, Anderson Singulani, Peter Hadley

Institut für Festkörperphysik (5130)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Abstract

Moisture uptake of materials, used in optoelectronic sensor packaging for the purpose of component attach or for encapsulation, is investigated. The diffusion behavior of these mostly epoxide-based polymer compounds is characterized under various temperature and humidity loads and described using analytical models. The water uptake during soak tests was determined and the data can be fit assuming multistep diffusion behavior. It is assumed that this behavior can be assigned to the formation of hydrogen bonds and moisture absorption in the free volume of the polymer matrix [1]. To investigate this assumption further, in addition to gravimetric methods, the evolution of the O-H stretch modes are measured by Attenuated Total Reflection Fourier Transform Infrared Spectroscopy (ATR-FTIR).

Originalsprache	englisch
Titel	2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings
Herausgeber (Verlag)	Institute of Electrical and Electronics Engineers
ISBN (elektronisch)	9781538668139
DOIs	https://doi.org/10.1109/ESTC.2018.8546489
Publikationsstatus	Veröffentlicht - 26 Nov. 2018
Veranstaltung	7th Electronic System-Integration Technology Conference - Dresden, Deutschland Dauer: 18 Sept. 2018 → 21 Sept. 2018

Konferenz

Konferenz	7th Electronic System-Integration Technology Conference
Kurztitel	STC 2018
Land/Gebiet	Deutschland
Ort	Dresden
Zeitraum	18/09/18 → 21/09/18

ASJC Scopus subject areas

Hardware und Architektur
Elektrotechnik und Elektronik
Elektronische, optische und magnetische Materialien

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10.1109/ESTC.2018.8546489

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Characterization of Moisture Uptake in Microelectronics Packaging Materials. / Huber, Fabian; Etschmaier, Harald; Wolfberger, Archim et al.
2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 2018. 8546489.

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Huber, F, Etschmaier, H, Wolfberger, A, Singulani, A & Hadley, P 2018, Characterization of Moisture Uptake in Microelectronics Packaging Materials. in 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings., 8546489, Institute of Electrical and Electronics Engineers, 7th Electronic System-Integration Technology Conference, Dresden, Deutschland, 18/09/18. https://doi.org/10.1109/ESTC.2018.8546489

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title = "Characterization of Moisture Uptake in Microelectronics Packaging Materials",

abstract = "Moisture uptake of materials, used in optoelectronic sensor packaging for the purpose of component attach or for encapsulation, is investigated. The diffusion behavior of these mostly epoxide-based polymer compounds is characterized under various temperature and humidity loads and described using analytical models. The water uptake during soak tests was determined and the data can be fit assuming multistep diffusion behavior. It is assumed that this behavior can be assigned to the formation of hydrogen bonds and moisture absorption in the free volume of the polymer matrix [1]. To investigate this assumption further, in addition to gravimetric methods, the evolution of the O-H stretch modes are measured by Attenuated Total Reflection Fourier Transform Infrared Spectroscopy (ATR-FTIR).",

keywords = "ATR-FTIR, diffusion, EMC, FEA, microelectronics, packaging materials, reliability, spectroscopy",

author = "Fabian Huber and Harald Etschmaier and Archim Wolfberger and Anderson Singulani and Peter Hadley",

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doi = "10.1109/ESTC.2018.8546489",

language = "English",

booktitle = "2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers",

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note = "7th Electronic System-Integration Technology Conference, STC 2018 ; Conference date: 18-09-2018 Through 21-09-2018",

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TY - GEN

T1 - Characterization of Moisture Uptake in Microelectronics Packaging Materials

AU - Huber, Fabian

AU - Etschmaier, Harald

AU - Wolfberger, Archim

AU - Singulani, Anderson

AU - Hadley, Peter

PY - 2018/11/26

Y1 - 2018/11/26

N2 - Moisture uptake of materials, used in optoelectronic sensor packaging for the purpose of component attach or for encapsulation, is investigated. The diffusion behavior of these mostly epoxide-based polymer compounds is characterized under various temperature and humidity loads and described using analytical models. The water uptake during soak tests was determined and the data can be fit assuming multistep diffusion behavior. It is assumed that this behavior can be assigned to the formation of hydrogen bonds and moisture absorption in the free volume of the polymer matrix [1]. To investigate this assumption further, in addition to gravimetric methods, the evolution of the O-H stretch modes are measured by Attenuated Total Reflection Fourier Transform Infrared Spectroscopy (ATR-FTIR).

AB - Moisture uptake of materials, used in optoelectronic sensor packaging for the purpose of component attach or for encapsulation, is investigated. The diffusion behavior of these mostly epoxide-based polymer compounds is characterized under various temperature and humidity loads and described using analytical models. The water uptake during soak tests was determined and the data can be fit assuming multistep diffusion behavior. It is assumed that this behavior can be assigned to the formation of hydrogen bonds and moisture absorption in the free volume of the polymer matrix [1]. To investigate this assumption further, in addition to gravimetric methods, the evolution of the O-H stretch modes are measured by Attenuated Total Reflection Fourier Transform Infrared Spectroscopy (ATR-FTIR).

KW - ATR-FTIR

KW - diffusion

KW - EMC

KW - FEA

KW - microelectronics

KW - packaging materials

KW - reliability

KW - spectroscopy

UR - http://www.scopus.com/inward/record.url?scp=85060049879&partnerID=8YFLogxK

U2 - 10.1109/ESTC.2018.8546489

DO - 10.1109/ESTC.2018.8546489

M3 - Conference paper

AN - SCOPUS:85060049879

BT - 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings

PB - Institute of Electrical and Electronics Engineers

T2 - 7th Electronic System-Integration Technology Conference

Y2 - 18 September 2018 through 21 September 2018

ER -

Characterization of Moisture Uptake in Microelectronics Packaging Materials

Abstract

Konferenz

ASJC Scopus subject areas

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