Abstract
An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.
Originalsprache | englisch |
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Titel | 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020 |
Seiten | 200-204 |
Seitenumfang | 5 |
ISBN (elektronisch) | 978-1-7281-7430-3 |
DOIs | |
Publikationsstatus | Veröffentlicht - Juli 2020 |
Veranstaltung | 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity: EMCSI 2020 - Virtual, Reno, USA / Vereinigte Staaten Dauer: 27 Juli 2020 → 31 Juli 2020 |
Konferenz
Konferenz | 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity |
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Kurztitel | EMCSI 2020 |
Land/Gebiet | USA / Vereinigte Staaten |
Ort | Virtual, Reno |
Zeitraum | 27/07/20 → 31/07/20 |
ASJC Scopus subject areas
- Informationssysteme und -management
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Signalverarbeitung
- Strahlung
- Elektrotechnik und Elektronik