Correlation of thin film measurement techniques for device packing processes

W. Mack, J. Walter, C.Y. Lee, Christian Gspan

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Originalsprache	englisch
Titel	International Symposium for Testing and Failure Analysis
Herausgeber (Verlag)	.
Seiten	192-197
Publikationsstatus	Veröffentlicht - 2014
Veranstaltung	International Symposium for Testing and Failure Analysis - Houston, Texas, USA / Vereinigte Staaten Dauer: 9 Nov. 2014 → 13 Nov. 2014

Konferenz	International Symposium for Testing and Failure Analysis
Land/Gebiet	USA / Vereinigte Staaten
Ort	Houston, Texas
Zeitraum	9/11/14 → 13/11/14

Fields of Expertise

@inproceedings{7a005261c8724a74ae472e3a70a0b7e3,

title = "Correlation of thin film measurement techniques for device packing processes",

author = "W. Mack and J. Walter and C.Y. Lee and Christian Gspan",

year = "2014",

language = "English",

pages = "192--197",

booktitle = "International Symposium for Testing and Failure Analysis",

publisher = ".",

note = "International Symposium for Testing and Failure Analysis ; Conference date: 09-11-2014 Through 13-11-2014",

}

TY - GEN

T1 - Correlation of thin film measurement techniques for device packing processes

AU - Mack, W.

AU - Walter, J.

AU - Lee, C.Y.

AU - Gspan, Christian

PY - 2014

Y1 - 2014

M3 - Conference paper

SP - 192

EP - 197

BT - International Symposium for Testing and Failure Analysis

PB - .

T2 - International Symposium for Testing and Failure Analysis

Y2 - 9 November 2014 through 13 November 2014

ER -