Electrical Resistivity of High Melting Metals (W, Mo, Re, Ta, Nb, Ir and Hf) up into the liquid phase

Claus Cagran, Thomas Hüpf, Gernot Pottlacher

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Originalsprache	englisch
Titel	International Conference on Tungsten, Refractory & Hardmaterials
Herausgeber (Verlag)	.
Seiten	1-1
Publikationsstatus	Veröffentlicht - 2008
Veranstaltung	International Conference on Tungsten, Refractory & Hardmaterials - Washington, USA / Vereinigte Staaten Dauer: 8 Juni 2008 → 12 Juni 2008

Konferenz	International Conference on Tungsten, Refractory & Hardmaterials
Land/Gebiet	USA / Vereinigte Staaten
Ort	Washington
Zeitraum	8/06/08 → 12/06/08

Treatment code (Nähere Zuordnung)

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title = "Electrical Resistivity of High Melting Metals (W, Mo, Re, Ta, Nb, Ir and Hf) up into the liquid phase",

author = "Claus Cagran and Thomas H{\"u}pf and Gernot Pottlacher",

year = "2008",

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note = "International Conference on Tungsten, Refractory & Hardmaterials ; Conference date: 08-06-2008 Through 12-06-2008",

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T1 - Electrical Resistivity of High Melting Metals (W, Mo, Re, Ta, Nb, Ir and Hf) up into the liquid phase

AU - Cagran, Claus

AU - Hüpf, Thomas

AU - Pottlacher, Gernot

PY - 2008

Y1 - 2008

UR - http://www.mpif.org/Meetings/2008/Tung_08_tech_pgm.pdf

M3 - Conference paper

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BT - International Conference on Tungsten, Refractory & Hardmaterials

PB - .

T2 - International Conference on Tungsten, Refractory & Hardmaterials

Y2 - 8 June 2008 through 12 June 2008

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