Honeycomb-structured copper indium sulfide thin films obtained via a nanosphere colloidal lithography method

Efthymia Vakalopoulou, Thomas Rath*, Fernando Gustavo Warchomicka, Francesco Carraro, Paolo Falcaro, Heinz Amenitsch, Gregor Trimmel

*Korrespondierende/r Autor/-in für diese Arbeit

Publikation: Beitrag in einer FachzeitschriftArtikelBegutachtung

Abstract

The large surface-to-volume ratio and the huge surface area of an ordered nanostructure is essential for improving the performance of many metal sulfide-based technologies within energy conversion and storage, but also catalysis and sensing. Although, several routes toward the formation of nanostructured metal sulfide thin films have been already developed, their fabrication is still challenging. Herein, we present a novel method for the preparation of honeycomb-structured CuInS2 thin films via a nanosphere colloidal lithography technique using monodisperse polystyrene nanosphere layers, formed by a self-assembly approach at the air/liquid interface, as template. The size of the spheres can be reduced by an O2 plasma etching process, thereby enlarging the free space between the spheres. Infiltration of the template with metal xanthates followed by their thermal conversion to CuInS2 and the thermal removal of the polymeric template leads to ordered honeycomb-structured films. In an alternative route, the template is infiltrated with a tailored CuInS2 nanoparticle ink before the template is removed by dissolution.

Originalspracheenglisch
Seiten (von - bis)2884-2895
Seitenumfang12
FachzeitschriftMaterials Advances
Jahrgang3
Ausgabenummer6
DOIs
PublikationsstatusVeröffentlicht - 24 Feb. 2022

ASJC Scopus subject areas

  • Allgemeine Materialwissenschaften
  • Chemie (sonstige)

Fields of Expertise

  • Advanced Materials Science

Fingerprint

Untersuchen Sie die Forschungsthemen von „Honeycomb-structured copper indium sulfide thin films obtained via a nanosphere colloidal lithography method“. Zusammen bilden sie einen einzigartigen Fingerprint.

Dieses zitieren