Investigations on Microstrip and Ground Plane Partial Inductance in Finite-Width Structures

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandBegutachtung

Abstract

This work deals with the inductive behaviour of microstrip traces, ground planes and similar structures for the purpose of conducted EMI simulation. Partial Element Equivalent Circuit (PEEC) simulations are performed for different pairings of trace-width, ground plane-width and height of trace over the ground plane. The results of the simulations are presented, compared with results from other software (FastHenry) and discussed. The observation was made that the ground plane’s partial inductance stays constant for most cases, independent of the trace width and trace height. In this work, an attempt is made to explain this phenomenon. Also, it was observed that the mutual partial inductance is mostly independent of trace width, however, a dependency of the ground plane width is given.
Originalspracheenglisch
Titel2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024
Herausgeber (Verlag)IEEE
Seitenumfang5
ISBN (elektronisch)979-8-3315-0463-2
ISBN (Print)979-8-3315-0464-9
DOIs
PublikationsstatusVeröffentlicht - 6 Nov. 2024
Veranstaltung14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024 - Turin, Italien
Dauer: 7 Okt. 20249 Okt. 2024

Konferenz

Konferenz14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024
KurztitelEMC Compo
Land/GebietItalien
OrtTurin
Zeitraum7/10/249/10/24

ASJC Scopus subject areas

  • Elektrotechnik und Elektronik
  • Sicherheit, Risiko, Zuverlässigkeit und Qualität

Fields of Expertise

  • Information, Communication & Computing

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)

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