Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies

Arash Arsanjani; Ziad Hatab; Ahmad Bader Alothman Alterkawi; Michael Ernst Gadringer; Wolfgang Bösch

doi:10.1109/ARFTG61196.2024.10660794

Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies

Arash Arsanjani, Ziad Hatab, Ahmad Bader Alothman Alterkawi, Michael Ernst Gadringer, Wolfgang Bösch

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Abstract

This paper explores the potential of the modified semi-additive process (mSAP) for precise manufacturing and measurement of structures on printed circuit boards (PCBs), with a particular emphasis on high-frequency applications. One example discussed in this paper is the measurement of a substrate-integrated waveguide (SIW) loaded with mushroom metasurface unitcells. Given the high sensitivity of metasurface structures to fabrication errors, this serves as a relevant case study. Our invetigation includes a detailed evaluation, incorporating X-ray analysis, a cross-sectional analysis, and S-parameters measurements up to 150 GHz using customized multiline thru-reflect-line (TRL) with uncertainty analysis. The measurement results show strongly agree with electromagnetic(EM) simulation, highlighting the suitability of mSAP technology for accurate fabrication and enabling measurement of high-frequency devices.

Originalsprache	englisch
Titel	103rd ARFTG Microwave Measurement Conference
Untertitel	Advanced Measurement Techniques for Next-G Communication Systems, ARFTG 2024
Herausgeber (Verlag)	IEEE CSP
Seitenumfang	4
ISBN (elektronisch)	9798350362732
ISBN (Print)	979-8-3503-6274-9
DOIs	https://doi.org/10.1109/ARFTG61196.2024.10660794
Publikationsstatus	Veröffentlicht - 21 Juni 2024
Veranstaltung	103rd ARFTG Microwave Measurement Conference: ARFTG 2024 - Washington, DC, USA / Vereinigte Staaten Dauer: 21 Juni 2024 → 21 Juni 2024

Konferenz

Konferenz	103rd ARFTG Microwave Measurement Conference
Land/Gebiet	USA / Vereinigte Staaten
Ort	Washington, DC
Zeitraum	21/06/24 → 21/06/24

Schlagwörter

Microwave measurement
Fabrication
Accuracy
Uncertainty
Millimeter wave measurements
Printed circuits
Measurement uncertainty

ASJC Scopus subject areas

Elektrotechnik und Elektronik
Instrumentierung
Signalverarbeitung
Computernetzwerke und -kommunikation

Fields of Expertise

Information, Communication & Computing

Treatment code (Nähere Zuordnung)

Experimental

Zugriff auf Dokument

10.1109/ARFTG61196.2024.10660794

Andere Dateien und Links

Verknüpfung zur Publikation in Scopus

1 Laufend

CD-Labor für Technologie basiertes Design und Charakterisierung von elektronischen Komponenten
Bösch, W. (Teilnehmer (Co-Investigator)), Hatab, Z. (Teilnehmer (Co-Investigator)), Gadringer, M. E. (Teilnehmer (Co-Investigator)), Takahashi, H. (Teilnehmer (Co-Investigator)), Maier, C. (Teilnehmer (Co-Investigator)), Sarbandi Farahani, H. (Teilnehmer (Co-Investigator)), Pauser-Greistorfer, C. (Teilnehmer (Co-Investigator)), Paulitsch, H. (Teilnehmer (Co-Investigator)), Rezaee, B. (Teilnehmer (Co-Investigator)) & Fuchs, M. (Teilnehmer (Co-Investigator))
1/11/20 → 31/10/27
Projekt: Forschungsprojekt

2 Beitrag in einem Konferenzband
1 Artikel
1 Preprint

A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss
Hatab, Z., Takahashi, H., Alterkawi, A. B. A., Gadringer, M. E. & Bösch, W., 21 Sept. 2023, 2023 53rd European Microwave Conference, EuMC 2023. ACM/IEEE, S. 62-65 4 S. 10290259
Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung
Experimental analysis of grounded coplanar waveguide structures based on different PCB processes with uncertainty analysis
Takahashi, H., Hatab, Z., Schlaffer, E., Paulitsch, H. & Bösch, W., 2023, in: IEICE Electronics Express. 20, 21, 6 S., e20230381.
Publikation: Beitrag in einer Fachzeitschrift › Artikel › Begutachtung
Propagation of Linear Uncertainties through Multiline Thru-Reflect-Line Calibration
Hatab, Z., Gadringer, M. E. & Bösch, W., 22 Jan. 2023, arXiv, 9 S.
Publikation: Arbeitspapier › Preprint

Open Access
Datei

Dieses zitieren

Arsanjani, A., Hatab, Z., Alterkawi, A. B. A., Gadringer, M. E., & Bösch, W. (2024). Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies. in 103rd ARFTG Microwave Measurement Conference: Advanced Measurement Techniques for Next-G Communication Systems, ARFTG 2024 Artikel 10660794 IEEE CSP. https://doi.org/10.1109/ARFTG61196.2024.10660794

Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies. / Arsanjani, Arash; Hatab, Ziad; Alterkawi, Ahmad Bader Alothman et al.
103rd ARFTG Microwave Measurement Conference: Advanced Measurement Techniques for Next-G Communication Systems, ARFTG 2024. IEEE CSP, 2024. 10660794.

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Arsanjani, A, Hatab, Z, Alterkawi, ABA, Gadringer, ME & Bösch, W 2024, Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies. in 103rd ARFTG Microwave Measurement Conference: Advanced Measurement Techniques for Next-G Communication Systems, ARFTG 2024., 10660794, IEEE CSP, 103rd ARFTG Microwave Measurement Conference, Washington, DC, USA / Vereinigte Staaten, 21/06/24. https://doi.org/10.1109/ARFTG61196.2024.10660794

Arsanjani A, Hatab Z, Alterkawi ABA, Gadringer ME , Bösch W. Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies. in 103rd ARFTG Microwave Measurement Conference: Advanced Measurement Techniques for Next-G Communication Systems, ARFTG 2024. IEEE CSP. 2024. 10660794 doi: 10.1109/ARFTG61196.2024.10660794

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title = "Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies",

abstract = "This paper explores the potential of the modified semi-additive process (mSAP) for precise manufacturing and measurement of structures on printed circuit boards (PCBs), with a particular emphasis on high-frequency applications. One example discussed in this paper is the measurement of a substrate-integrated waveguide (SIW) loaded with mushroom metasurface unitcells. Given the high sensitivity of metasurface structures to fabrication errors, this serves as a relevant case study. Our invetigation includes a detailed evaluation, incorporating X-ray analysis, a cross-sectional analysis, and S-parameters measurements up to 150 GHz using customized multiline thru-reflect-line (TRL) with uncertainty analysis. The measurement results show strongly agree with electromagnetic(EM) simulation, highlighting the suitability of mSAP technology for accurate fabrication and enabling measurement of high-frequency devices.",

keywords = "Microwave measurement, Fabrication, Accuracy, Uncertainty, Millimeter wave measurements, Printed circuits, Measurement uncertainty, calibration, metasurface, microwave measurement, millimeter-wave, modifieds semi-additive process, printed circuit board, sub-terahertz, subtractive manufacturing",

author = "Arash Arsanjani and Ziad Hatab and Alterkawi, {Ahmad Bader Alothman} and Gadringer, {Michael Ernst} and Wolfgang B{\"o}sch",

year = "2024",

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doi = "10.1109/ARFTG61196.2024.10660794",

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isbn = "979-8-3503-6274-9",

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AU - Arsanjani, Arash

AU - Hatab, Ziad

AU - Alterkawi, Ahmad Bader Alothman

AU - Gadringer, Michael Ernst

AU - Bösch, Wolfgang

PY - 2024/6/21

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N2 - This paper explores the potential of the modified semi-additive process (mSAP) for precise manufacturing and measurement of structures on printed circuit boards (PCBs), with a particular emphasis on high-frequency applications. One example discussed in this paper is the measurement of a substrate-integrated waveguide (SIW) loaded with mushroom metasurface unitcells. Given the high sensitivity of metasurface structures to fabrication errors, this serves as a relevant case study. Our invetigation includes a detailed evaluation, incorporating X-ray analysis, a cross-sectional analysis, and S-parameters measurements up to 150 GHz using customized multiline thru-reflect-line (TRL) with uncertainty analysis. The measurement results show strongly agree with electromagnetic(EM) simulation, highlighting the suitability of mSAP technology for accurate fabrication and enabling measurement of high-frequency devices.

AB - This paper explores the potential of the modified semi-additive process (mSAP) for precise manufacturing and measurement of structures on printed circuit boards (PCBs), with a particular emphasis on high-frequency applications. One example discussed in this paper is the measurement of a substrate-integrated waveguide (SIW) loaded with mushroom metasurface unitcells. Given the high sensitivity of metasurface structures to fabrication errors, this serves as a relevant case study. Our invetigation includes a detailed evaluation, incorporating X-ray analysis, a cross-sectional analysis, and S-parameters measurements up to 150 GHz using customized multiline thru-reflect-line (TRL) with uncertainty analysis. The measurement results show strongly agree with electromagnetic(EM) simulation, highlighting the suitability of mSAP technology for accurate fabrication and enabling measurement of high-frequency devices.

KW - Microwave measurement

KW - Fabrication

KW - Accuracy

KW - Uncertainty

KW - Millimeter wave measurements

KW - Printed circuits

KW - Measurement uncertainty

KW - calibration

KW - metasurface

KW - microwave measurement

KW - millimeter-wave

KW - modifieds semi-additive process

KW - printed circuit board

KW - sub-terahertz

KW - subtractive manufacturing

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U2 - 10.1109/ARFTG61196.2024.10660794

DO - 10.1109/ARFTG61196.2024.10660794

M3 - Conference paper

SN - 979-8-3503-6274-9

BT - 103rd ARFTG Microwave Measurement Conference

PB - IEEE CSP

T2 - 103rd ARFTG Microwave Measurement Conference

Y2 - 21 June 2024 through 21 June 2024

ER -

Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies

Abstract

Konferenz

Schlagwörter

ASJC Scopus subject areas

Fields of Expertise

Treatment code (Nähere Zuordnung)

Zugriff auf Dokument

Andere Dateien und Links

Projekte

CD-Labor für Technologie basiertes Design und Charakterisierung von elektronischen Komponenten

Publikationen

A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss

Experimental analysis of grounded coplanar waveguide structures based on different PCB processes with uncertainty analysis

Propagation of Linear Uncertainties through Multiline Thru-Reflect-Line Calibration

Dieses zitieren