Thermal Expansion in Pulse - Heating

Thomas Hüpf; Claus Cagran; Gernot Pottlacher

Thermal Expansion in Pulse - Heating

Thomas Hüpf, Claus Cagran, Gernot Pottlacher

Institut für Experimentalphysik (5110)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Originalsprache	englisch
Titel	30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES)
Herausgeber (Verlag)	.
Seiten	57-57
Publikationsstatus	Veröffentlicht - 2009
Veranstaltung	30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES) - Pittsburgh, USA / Vereinigte Staaten Dauer: 29 Aug. 2009 → 2 Sep. 2009

Konferenz

Konferenz	30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES)
Land/Gebiet	USA / Vereinigte Staaten
Ort	Pittsburgh
Zeitraum	29/08/09 → 2/09/09

Treatment code (Nähere Zuordnung)

Experimental

Metallic Melts 2 - Electrical Resistivity Measurement of High Temperature Metallic Melts - Part 2
Hüpf, T., Cagran, C. & Pottlacher, G.
1/09/08 → 31/07/15
Projekt: Foschungsprojekt

Dieses zitieren

Hüpf, T, Cagran, C & Pottlacher, G 2009, Thermal Expansion in Pulse - Heating. in 30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES). ., S. 57-57, 30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES), Pittsburgh, USA / Vereinigte Staaten, 29/08/09.

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title = "Thermal Expansion in Pulse - Heating",

author = "Thomas H{\"u}pf and Claus Cagran and Gernot Pottlacher",

year = "2009",

language = "English",

pages = "57--57",

booktitle = "30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES)",

publisher = ".",

note = "30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES) ; Conference date: 29-08-2009 Through 02-09-2009",

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TY - GEN

T1 - Thermal Expansion in Pulse - Heating

AU - Hüpf, Thomas

AU - Cagran, Claus

AU - Pottlacher, Gernot

PY - 2009

Y1 - 2009

M3 - Conference paper

SP - 57

EP - 57

BT - 30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES)

PB - .

T2 - 30 th International Thermal Conductivity Conference (ITCC) and 18 th International Thermal Expansion Symposium (ITES)

Y2 - 29 August 2009 through 2 September 2009

ER -

Thermal Expansion in Pulse - Heating

Konferenz

Treatment code (Nähere Zuordnung)

Projekte

Metallic Melts 2 - Electrical Resistivity Measurement of High Temperature Metallic Melts - Part 2

Dieses zitieren