Aktivitäten pro Jahr
Abstract
The surface scan method constitutes an effective methodology to characterize printed circuit boards and integrated circuits in terms of electromagnetic emission and immunity. It is a useful technique to locate areas of critical radiation or susceptibility which could influence the performance of devices nearby or the device under test itself. The radiated near-field gathered during the test sequence is effectively influenced by the electric-and magnetic-field probes used in the course of the measurement process hence a calibration of the setup is required. This calibration is done via a 3D-FEM-wave simulation in the time domain, stimulated with a Gaussian pulse, to gather the near-field behavior over the frequency range of interest. The numerically derived results can be used during post processing to eliminate the probe's influence on the measured results.
Originalsprache | englisch |
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Titel | 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 |
Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers |
Seiten | 866-871 |
Seitenumfang | 6 |
ISBN (elektronisch) | 9781509059973 |
DOIs | |
Publikationsstatus | Veröffentlicht - 22 Juni 2018 |
Veranstaltung | 60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 - Suntec City, Singapur Dauer: 14 Mai 2018 → 18 Mai 2018 |
Konferenz
Konferenz | 60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 |
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Land/Gebiet | Singapur |
Ort | Suntec City |
Zeitraum | 14/05/18 → 18/05/18 |
ASJC Scopus subject areas
- Luft- und Raumfahrttechnik
- Elektrotechnik und Elektronik
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Strahlung
Fields of Expertise
- Information, Communication & Computing
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- 1 Konferenz oder Fachtagung (Teilnahme an/Organisation von)
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2018 JOINT IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY
Susanne Maria Bauer (Teilnehmer/-in)
14 Mai 2018 → 17 Mai 2018Aktivität: Teilnahme an / Organisation von › Konferenz oder Fachtagung (Teilnahme an/Organisation von)