TY - JOUR
T1 - Vacuum-Assisted Selective Adhesive Imprinting for Photonic Packaging of Complex MOEMS Devices
T2 - Assembly of Miniaturized Particle Sensor
AU - Pribosek, Jaka
AU - Zauner, Markus
AU - Bardong, Jochen
AU - Binder, Alfred
AU - Maierhofer, Paul
AU - Bergmann, Alexander
AU - Röhrer, Georg
PY - 2020/12/15
Y1 - 2020/12/15
N2 - In this paper we propose the selective adhesive bonding technique using contact imprinting from thin adhesive layers spin-coated on the sacrificial polymer foils. The contact imprinting process is assisted with vacuum. We propose three different methods in order to improve the selectivity of the adhesive application, control the adhesive thickness and reduce the pull-off adhesive force and prevent die sticking. We apply these methods in assembly of a miniaturized optical particle counter confronted with several strict assembly requirements, such as selective bonding with small feature size ( < 200mu text{m} ), minimal adhesive thickness ( < 15mu text{m} ), precise out-of plane tolerances, low adhesive squeeze-out and airtight and hermetically sealed packaging. A successful contact imprinting was demonstrated with ratio of vacuum tool area to adhesive contact area of 1:20. Die-bonding with minimal feature size of 70mu text{m} and trench size of 25mu text{m} was demonstrated.
AB - In this paper we propose the selective adhesive bonding technique using contact imprinting from thin adhesive layers spin-coated on the sacrificial polymer foils. The contact imprinting process is assisted with vacuum. We propose three different methods in order to improve the selectivity of the adhesive application, control the adhesive thickness and reduce the pull-off adhesive force and prevent die sticking. We apply these methods in assembly of a miniaturized optical particle counter confronted with several strict assembly requirements, such as selective bonding with small feature size ( < 200mu text{m} ), minimal adhesive thickness ( < 15mu text{m} ), precise out-of plane tolerances, low adhesive squeeze-out and airtight and hermetically sealed packaging. A successful contact imprinting was demonstrated with ratio of vacuum tool area to adhesive contact area of 1:20. Die-bonding with minimal feature size of 70mu text{m} and trench size of 25mu text{m} was demonstrated.
KW - heterogeneous integration
KW - MEMS
KW - MOEMS
KW - optical particle counter
KW - PM2.5
KW - Selective adhesive bonding
UR - http://www.scopus.com/inward/record.url?scp=85096645495&partnerID=8YFLogxK
U2 - 10.1109/JSEN.2020.3011216
DO - 10.1109/JSEN.2020.3011216
M3 - Article
AN - SCOPUS:85096645495
SN - 1530-437X
VL - 20
SP - 15053
EP - 15060
JO - IEEE Sensors Journal
JF - IEEE Sensors Journal
IS - 24
M1 - 9146292
ER -