TY - JOUR
T1 - Waveguide Cell with Water Filling for Passive Intermodulation Localization on Planar Circuits
AU - Chen, Xiong
AU - An, Lei
AU - Yu, Ming
AU - Pommerenke, David Johannes
PY - 2021/11/1
Y1 - 2021/11/1
N2 - This work presents a novel miniaturized waveguide cell with water filling for passive intermodulation (PIM) localization on planar circuits. The planar circuit as printed circuit board (PCB) is excited in a small waveguide, while its PIM product is detected simultaneously. The waveguide width is minimized by water filling (high permittivity dielectric), and the localization resolution is enhanced. During test, the PCB only needs move through the waveguide twice, once along its $X$ -direction and once along its $Y$ -direction. By crossing the peak PIM distribution line along two directions together, the regions on PCB have PIM responses that can be decided. The proposed method is intended for the planer PCB and other normal PCB with surface mount components.
AB - This work presents a novel miniaturized waveguide cell with water filling for passive intermodulation (PIM) localization on planar circuits. The planar circuit as printed circuit board (PCB) is excited in a small waveguide, while its PIM product is detected simultaneously. The waveguide width is minimized by water filling (high permittivity dielectric), and the localization resolution is enhanced. During test, the PCB only needs move through the waveguide twice, once along its $X$ -direction and once along its $Y$ -direction. By crossing the peak PIM distribution line along two directions together, the regions on PCB have PIM responses that can be decided. The proposed method is intended for the planer PCB and other normal PCB with surface mount components.
KW - Lump nonlinear source
KW - passive intermodulation (PIM)
KW - radiation detection
KW - water filling
KW - waveguide cell
UR - http://www.scopus.com/inward/record.url?scp=85118839248&partnerID=8YFLogxK
U2 - 10.1109/LMWC.2021.3090081
DO - 10.1109/LMWC.2021.3090081
M3 - Article
SN - 1531-1309
VL - 31
SP - 1247
EP - 1250
JO - IEEE Microwave and Wireless Components Letters
JF - IEEE Microwave and Wireless Components Letters
IS - 11
ER -