Modeling Swelling and Drying in Electronic Encapsulations

Description

For the protection of sensitive electronics against harsh environmental conditions,
highly crosslinked polymers play a crucial role as they act as a barrier against the
surrounding solvent phase. However, these polymers are also capable of taking up
solvent by themselves, which can cause electric malfunctioning.
In previous works, the absorption behavior of epoxy and polyphenolic resins, as well
as silicon, was investigated . In this context, the thermodynamic properties were
calculated using the PC-SAFT equation of state in combination with a network term
, and the solvent uptake was measured gravimetrically. However, alongside the
solvent uptake, the drying of polymeric networks is also of high interest for many
applications. Especially for electronics, the drying behavior connected to the heat flux
generated by active electronic components is of special interest. Therefore, the
developed model will be extended with an energy balance, and the influence of heat
transfer on mass transfer will be considered.
In this contribution, a three-dimensional model approach will be presented, and the
applicability of the model to consider both the swelling and the drying process will be
discussed.

Period	11 Jun 2024 → 13 Jun 2024
Event title	NordPac: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
Event type	Conference
Location	Tampere, FinlandShow on map
Degree of Recognition	International