Period | 21 Oct 2019 → 23 Oct 2019 |
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Event type | Conference |
Location | Haining, ChinaShow on map |
Degree of Recognition | International |
Documents & Links
Related content
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Research Outputs
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Soft-Failures in Component-Level ESD Testing on the Example of Flip-Flop Data Retention
Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
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Soft-Failures in Component-Level ESD Testing on the Example of a Bandgap
Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review
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Activities
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Soft-Failures in Component-Level ESD Testing on the Example of Flip-Flop Data Retention
Activity: Talk or presentation › Talk at conference or symposium › Science to science
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Soft-Failures in Component-Level ESD Testing on the Example of a Bandgap
Activity: Talk or presentation › Talk at conference or symposium › Science to science