Engineering
Additive Manufacturing
40%
Aerospace Applications
26%
Artificial Intelligence
20%
Artificial Neural Network
24%
Atomic Layer Deposition
40%
Automotives
33%
Behavioral Model
42%
Capacitive Coupling
40%
Cell Model
40%
Chemical Vapor Deposition
40%
Circuit Diagram
20%
Circuit Model
40%
Circuit Simulation
60%
Common Mode
53%
Common Mode Choke
40%
Common Practice
40%
Computer-Aided Design Model
40%
Conducted Emission
100%
Control System
40%
Core-Shell
40%
Coupling Effect
40%
Crosslinker
20%
Data Model
40%
Datasheet
20%
DC-to-DC Converter
40%
Density Estimate
40%
Design Criterion
20%
Design Engineer
40%
Design Feature
40%
Design Guideline
40%
Design Model
44%
Electric Field
30%
Electric Line
40%
Electric Power Plant
40%
Electrical System
40%
Electrode Gap
20%
Electromagnetic Compatibility
80%
Electromagnetic Coupling
40%
Electromagnetic Interference
100%
Electrostatic Discharge
40%
Engine Control
40%
Equivalent Circuit
100%
Fem Model
40%
Field Distribution
40%
Filter Design
60%
Finite Element Modeling
60%
Finite Element Simulation
40%
Flyback Converter
60%
Frequency Increase
40%
Gap Semiconductor
20%
Genetic Algorithm
40%
Global Positioning System
40%
Great Importance
40%
High-Frequency Component
40%
Hydrogel
40%
Individual Cell
40%
Induction Machine
40%
Learning System
40%
Linear Circuit
40%
Link Capacitor
40%
Lit Configuration
20%
Lowpass Filter
40%
Mass Concentration
20%
Matching Network
24%
Material Parameter
40%
Measured Data
40%
Measurement Setup
26%
Metal-Oxide-Semiconductor Field-Effect Transistor
60%
Nanorod
40%
near Field Communication
40%
Nitride
40%
Nodes
20%
Non-Dominated Sorting Genetic Algorithm II
40%
Optimisation Problem
40%
Particle Emission
40%
Particle Number
40%
Particle Number Concentration
40%
Particulate Emission
40%
Passive Component
40%
Plasmonics
40%
Reverberation Chamber
20%
Rocket Engine
40%
Scattering Parameters
73%
Schematic Diagram
20%
Sensing Performance
40%
Signal Waveform
20%
Simple Circuit
40%
Simulation Mode
44%
Soft-Switching
40%
Switching Activity
20%
Test Method
40%
Testing Method
40%
Thin Films
60%
Three Dimensional Printing
40%
Topology Control
40%
Transients
82%
Vapor Deposition
40%
Wave Model
20%
Wireless Power Transfer
80%
Zero Voltage Switching
40%
Computer Science
Abstract Representation
20%
Active Learning
40%
Analysed Data
13%
Automaton
80%
Behavioral Analysis
13%
Bluetooth Low Energy
26%
Business Model
40%
Business Model Innovation
40%
Case Generation
40%
Case Study
40%
Communication Protocol
13%
Constellation Diagram
8%
Continuous Variable
40%
Data Generation
13%
Decision Maker
13%
Deep Reinforcement Learning
40%
Density Estimate
40%
Effective Modeling
20%
Efficient Computation
20%
Ergonomics
5%
Exact Probability
6%
Expert Knowledge
5%
Failure Detection
40%
Fuzz Testing
40%
Fuzzing
5%
Industrial Application
20%
Key Exchange Protocol
8%
Learning Agent
25%
Learning Technique
13%
Line Impedance
20%
Markov Decision Process
100%
Mealy Machine
20%
Model Checking
20%
Network Protocols
40%
Neural Network
40%
Object Data Model
5%
Operational Environment
20%
Passive Component
40%
Performance Requirement
20%
Process Activity
13%
Process Innovation
13%
Reactive System
40%
Reinforcement Learning
100%
Security Server
8%
Security Violation
10%
Service Model
13%
Signal Constellation
8%
System Black Box
33%
Testing Aspect
10%
Traditional Business Model
5%
Traffic Control
20%
Trusted Relationship
5%
Unexpected Behavior
10%
World Application
13%
Material Science
Aerospace System
20%
Austenitic Stainless Steel
40%
Biomaterial
40%
Capacitor
40%
Capacitor Ceramics
40%
Cell Proliferation
6%
Chemical Vapor Deposition
26%
Conductor
13%
Crystallite
6%
Density
53%
Dielectric Spectroscopy
13%
Electrical Impedance
40%
Electronic Circuit
100%
Electronic Component
20%
Finite Element Modeling
13%
Gallium Nitride
40%
Hybrid Material
40%
Hydrogel
40%
Liquid Propellant
40%
Metal-Oxide-Semiconductor Field-Effect Transistor
26%
Nanorod
26%
Nitride Compound
40%
Permittivity
40%
Photocatalysts
13%
Piezoelectricity
13%
Silicon
13%
Surface (Surface Science)
40%
Surface Modification
6%
Surface Property
13%
Thin Films
93%
Three Dimensional Printing
40%
Transistor
40%
Tungsten Alloys
40%
Wide Band Gap Semiconductor
40%
X-Ray Diffraction
6%
Zinc Oxide
66%