Novel cutting wires for silicon wafers are to be fabricated. For this purpose a composite layer of a matrix metal and hard material particles has to be electrodeposited onto steel wire. A suitable dispersion electrolyte has to be developed and the deposited layers have to be characterised.
|Effective start/end date||1/09/13 → 28/02/14|
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.