DiaComp - Electrodeposition of diamond composite layers on cutting wire for wafer ingots

Project: Research project

Project Details


Novel cutting wires for silicon wafers are to be fabricated. For this purpose a composite layer of a matrix metal and hard material particles has to be electrodeposited onto steel wire. A suitable dispersion electrolyte has to be developed and the deposited layers have to be characterised.
Effective start/end date1/09/1328/02/14


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