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EU-CopPeR - Copper interconnects for advanced performance and reliability
Uusimäki, Toni
(Co-Investigator (CoI))
Gspan, Christian
(Co-Investigator (CoI))
Kothleitner, Gerald
(Principal Investigator (PI))
Institute of Electron Microscopy and Nanoanalysis (5190)
Project
:
Research project
Overview
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Publications
(2)
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Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.
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Weight
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Engineering
Performance
100%
Interconnects
100%
Reliability
100%
Deposition Process
66%
Barrier Film
33%
Nodes
33%
Main Advantage
33%
High Quality
33%
Metallizations
33%
Engineering
33%
Limitations
33%
Diffusion Barrier
33%
Additional Support
33%
Deposited Film
33%
Gas Fuel Manufacture
33%
Proof-of-Concept
33%
Development
33%
Device Scaling
33%
Material Science
Copper
100%
Electrical Resistivity
28%
Devices
14%
Electrolyte
14%
Analytical Method
14%
Ruthenium
14%
Solvent
14%
Plating
14%
Tantalum
14%
Chemical Engineering
Copper
100%
Metallizing
14%
Metal and Alloys--Plating
14%
Ruthenium
14%
Tantalum
14%