3D MEMS and IC Integration

Maaike Margrete Visser Taklo; Nicolas Lietaer; Hannah Rosquist Tofteberg; Timo Seppänen; Josef Prainsack; Josef Weber; Peter Ramm

doi:10.1557/PROC-1112-E04-04

3D MEMS and IC Integration

Maaike Margrete Visser Taklo, Nicolas Lietaer, Hannah Rosquist Tofteberg, Timo Seppänen, Josef Prainsack, Josef Weber, Peter Ramm

Institute of Signal Processing and Speech Communication (4420)

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Original language	English
Title of host publication	Symposium E: Materials and Technologies for 3-D Integration
Publisher	.
Pages	1-8
DOIs	https://doi.org/10.1557/PROC-1112-E04-04
Publication status	Published - 2008
Event	Materials Research Society Fall Meeting - Boston, United States Duration: 1 Dec 2008 → 5 Dec 2008

Conference

Conference	Materials Research Society Fall Meeting
Country/Territory	United States
City	Boston
Period	1/12/08 → 5/12/08

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10.1557/PROC-1112-E04-04

Cite this

@inproceedings{f4654fc22e4846ea9e31df248a57c3d8,

title = "3D MEMS and IC Integration",

author = "{Visser Taklo}, {Maaike Margrete} and Nicolas Lietaer and {Rosquist Tofteberg}, Hannah and Timo Sepp{\"a}nen and Josef Prainsack and Josef Weber and Peter Ramm",

year = "2008",

doi = "10.1557/PROC-1112-E04-04",

language = "English",

pages = "1--8",

booktitle = "Symposium E: Materials and Technologies for 3-D Integration",

publisher = ".",

note = "Materials Research Society Fall Meeting ; Conference date: 01-12-2008 Through 05-12-2008",

}

TY - GEN

T1 - 3D MEMS and IC Integration

AU - Visser Taklo, Maaike Margrete

AU - Lietaer, Nicolas

AU - Rosquist Tofteberg, Hannah

AU - Seppänen, Timo

AU - Prainsack, Josef

AU - Weber, Josef

AU - Ramm, Peter

PY - 2008

Y1 - 2008

UR - http://www.mrs.org/s_mrs/sec.asp?CID=17018&DID=217451

UR - http://www.mrs.org/s_mrs/sec_subscribe.asp?CID=16750&DID=231831&action=detail

U2 - 10.1557/PROC-1112-E04-04

DO - 10.1557/PROC-1112-E04-04

M3 - Conference paper

SP - 1

EP - 8

BT - Symposium E: Materials and Technologies for 3-D Integration

PB - .

T2 - Materials Research Society Fall Meeting

Y2 - 1 December 2008 through 5 December 2008

ER -

3D MEMS and IC Integration

Conference

Treatment code (Nähere Zuordnung)

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Cite this