Abstract
Tri(ethylene glycol) divinyl ether and the spiro-orthoester 2-((allyloxy)methy)-1,4,6-trioxospiro[4.4]nonane can be formulated in different ratios and crosslinked by thiol-ene reactions. The spiro-orthoester is used as anti-shrinkage additive, enabling shrinkage reduction of up to 39%. Addition of a radical photoinitiator for the thiol-ene reaction and a cationic photoinitiator for the double ring-opening of the spiro-orthoester enables dual-curing for application in 3D-printing. The formulation free of the spiro-orthoester shows gelation during the printing process and, correspondingly, low resolution. The formulations containing the spiro-orthoester exhibit higher resolutions in the range of 50 µm. The resins containing mixtures of tri(ethylene glycol) divinyl ether and the spiro-orthoester show permittivities as high as 104. The dielectric loss factor of the resins is in the range of 0.5–7.6, and the conductivity in the range of 1.3⋅10−11 to 2.0⋅10−11 S cm−1. These high-κ materials can be 3D-printed by digital light processing for the next generation of electronic materials.
Original language | English |
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Article number | 1900515 |
Number of pages | 10 |
Journal | Macromolecular Materials and Engineering |
Volume | 304 |
Issue number | 12 |
DOIs | |
Publication status | Published - 1 Dec 2019 |
Keywords
- anti-shrinkage additives
- high-κ dielectrics
- photopolymerization
- spiro-orthoesters
- thiol-ene click reaction
ASJC Scopus subject areas
- Chemical Engineering(all)
- Organic Chemistry
- Polymers and Plastics
- Materials Chemistry
Fields of Expertise
- Advanced Materials Science
Cooperations
- NAWI Graz