A Modular Approach of an Electromagnetic Compatibility Test System for Integrated Circuits

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review

Abstract

To bring automotive integrated circuits (ICs) to market, manufacturers must subject their products to numerous electromagnetic compatibility (EMC) tests such as electromagnetic immunity and emission tests, or electrostatic discharge (ESD) tests. These tests need EMC test boards that meet the specific standards’ requirements. However, the current need to increase the frequency range of EMC tests poses a challenge in designing standard-compliant test boards. In this paper, we address this issue by introducing a modular and reusable IC level EMC test system. We demonstrate the system’s effectiveness with an example of a direct power injection (DPI) test setup. It is shown how the frequency range can be expanded while minimizing costs and design efforts for the EMC test board design.
Original languageEnglish
Title of host publication2023 Austrochip Workshop on Microelectronics, Austrochip 2023 - Proceedings
PublisherACM/IEEE
Pages19-22
Number of pages4
ISBN (Electronic)9798350357851
ISBN (Print)979-8-3503-5786-8
DOIs
Publication statusPublished - 21 Sept 2023
Event2023 Austrochip Workshop on Microelectronics: Austrochip 2023 - Graz, Austria
Duration: 20 Sept 202321 Sept 2023

Workshop

Workshop2023 Austrochip Workshop on Microelectronics
Abbreviated titleAustrochip 2023
Country/TerritoryAustria
CityGraz
Period20/09/2321/09/23

Keywords

  • Electromagnetic Compatibility (EMC)
  • Integrated Circuit (IC)
  • Modular Test System
  • Radio Frequency (RF)
  • Reusable

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Instrumentation
  • Electrical and Electronic Engineering
  • Hardware and Architecture

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