A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits

Timm Ostermann; C. Bacher; D. Schneider; W. Gut; C. Lackner; R. Koessl; R. Hagelauer; Bernd Deutschmann; R. Jungreithmair

doi:10.1109/ICSMC2.2003.1428188

A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits

Timm Ostermann, C. Bacher, D. Schneider, W. Gut, C. Lackner, R. Koessl, R. Hagelauer, Bernd Deutschmann, R. Jungreithmair

Institute of Electronics (4390)

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Original language	English
Title of host publication	International Symposium on Electromagnetic Compatibility
Publisher	.
Pages	44-47
ISBN (Print)	0-7803-7779-6
DOIs	https://doi.org/10.1109/ICSMC2.2003.1428188
Publication status	Published - 2003
Event	International Symposium on Electromagnetic Compatibility: EMC 2003 - Istanbul, Turkey Duration: 11 May 2003 → 16 May 2003

Conference

Conference	International Symposium on Electromagnetic Compatibility
Country/Territory	Turkey
City	Istanbul
Period	11/05/03 → 16/05/03

Fields of Expertise

Sonstiges

Access to Document

10.1109/ICSMC2.2003.1428188

Cite this

Ostermann, T., Bacher, C., Schneider, D., Gut, W., Lackner, C., Koessl, R., Hagelauer, R., Deutschmann, B., & Jungreithmair, R. (2003). A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits. In International Symposium on Electromagnetic Compatibility (pp. 44-47). .. https://doi.org/10.1109/ICSMC2.2003.1428188

Ostermann, T, Bacher, C, Schneider, D, Gut, W, Lackner, C, Koessl, R, Hagelauer, R, Deutschmann, B & Jungreithmair, R 2003, A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits. in International Symposium on Electromagnetic Compatibility. ., pp. 44-47, International Symposium on Electromagnetic Compatibility, Istanbul, Turkey, 11/05/03. https://doi.org/10.1109/ICSMC2.2003.1428188

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title = "A Test-Chip to Characterize the Benefit of On-chip Decoupling to Reduce the Electromagnetic Emission of Integrated Circuits",

author = "Timm Ostermann and C. Bacher and D. Schneider and W. Gut and C. Lackner and R. Koessl and R. Hagelauer and Bernd Deutschmann and R. Jungreithmair",

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AU - Lackner, C.

AU - Koessl, R.

AU - Hagelauer, R.

AU - Deutschmann, Bernd

AU - Jungreithmair, R.

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