Characterization of the immunity of integrated circuits (ICs) at wafer level

Andrea Lavarda; Dominik Amschl; Susanne Bauer; Bernd Deutschmann

doi:10.1109/EMCCompo.2015.7358356

Characterization of the immunity of integrated circuits (ICs) at wafer level

Andrea Lavarda, Dominik Amschl, Susanne Bauer, Bernd Deutschmann

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

This paper deals with the characterization of the immunity of integrated circuits (ICs) by means of their susceptibility to conducted radio frequency (RF) electromagnetic interferences (EMI). It describes and analyses a framework to perform such characterization at wafer level, highlighting the benefits that are reaped from it and the problems that can be faced during the test bench setup and the measurement procedure, providing some possible solutions.

Original language	German
Title of host publication	2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Publisher	IEEE Publications
Pages	196-201
Number of pages	6
ISBN (Print)	978-1-4673-7896-3
DOIs	https://doi.org/10.1109/EMCCompo.2015.7358356
Publication status	Published - 13 Nov 2015
Event	2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Edinburgh, UK Duration: 10 Nov 2015 → 13 Nov 2015

Conference

Conference	2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Period	10/11/15 → 13/11/15

Access to Document

10.1109/EMCCompo.2015.7358356

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7358356

Cite this

Characterization of the immunity of integrated circuits (ICs) at wafer level. / Lavarda, Andrea; Amschl, Dominik; Bauer, Susanne et al.
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo). IEEE Publications, 2015. p. 196-201 7358356.

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Lavarda, A, Amschl, D, Bauer, S & Deutschmann, B 2015, Characterization of the immunity of integrated circuits (ICs) at wafer level. in 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)., 7358356, IEEE Publications, pp. 196-201, 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 10/11/15. https://doi.org/10.1109/EMCCompo.2015.7358356

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Y2 - 10 November 2015 through 13 November 2015

ER -

Characterization of the immunity of integrated circuits (ICs) at wafer level

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