Coupling Path Visualization and EMI Mitigation for Flyover QSFP Connectors

Atieh Talebzadeh; Pranay Kumar Vuppunutala; Kyoungchoul Koo; Hongyu Li; Jim Nadolny; Qian Liu; Jing Li; Kaustav Ghosh; Philippe Sochoux; Victor Khilkevich; James L. Drewniak; David Johannes Pommerenke

doi:10.1109/TEMC.2019.2943290

Coupling Path Visualization and EMI Mitigation for Flyover QSFP Connectors

Atieh Talebzadeh, Pranay Kumar Vuppunutala, Kyoungchoul Koo, Hongyu Li, Jim Nadolny, Qian Liu, Jing Li, Kaustav Ghosh, Philippe Sochoux, Victor Khilkevich, James L. Drewniak, David Johannes Pommerenke

Research output: Contribution to journal › Article › peer-review

Abstract

In this article, the energy parcels concept is used to reveal radiation physics and coupling in the entire structure of flyover quad form-factor pluggable (QSFP) interconnection. Flyover QSFP has better signal integrity than legacy surface mounted printed circuit board QSFP technology. To understand electromagnetic interference aspects, a simulation model was built and correlated to measured total radiated power (TRP) for common mode and differential mode excitations for a frequency range of 1–40 GHz. Further, the energy parcels and their trajectories concept were applied to visualize the coupling path by tracking back the energy parcels from outside of the chassis (quiet side) toward a host board inside the chassis (noisy side). Then, high-density regions of energy parcel trajectories guide where to place the absorbing material efficiently and appropriately. Two locations were examined by filling them with electromagnetic lossy material and improvement was validated by TRP simulation and measurement.

Original language	English
Journal	IEEE Transactions on Electromagnetic Compatibility
DOIs	https://doi.org/10.1109/TEMC.2019.2943290
Publication status	E-pub ahead of print - 22 Oct 2019
Externally published	Yes

Access to Document

10.1109/TEMC.2019.2943290

Cite this

@article{b5d55eadbccc4273be68ea98e3829d5b,

title = "Coupling Path Visualization and EMI Mitigation for Flyover QSFP Connectors",

abstract = "In this article, the energy parcels concept is used to reveal radiation physics and coupling in the entire structure of flyover quad form-factor pluggable (QSFP) interconnection. Flyover QSFP has better signal integrity than legacy surface mounted printed circuit board QSFP technology. To understand electromagnetic interference aspects, a simulation model was built and correlated to measured total radiated power (TRP) for common mode and differential mode excitations for a frequency range of 1–40 GHz. Further, the energy parcels and their trajectories concept were applied to visualize the coupling path by tracking back the energy parcels from outside of the chassis (quiet side) toward a host board inside the chassis (noisy side). Then, high-density regions of energy parcel trajectories guide where to place the absorbing material efficiently and appropriately. Two locations were examined by filling them with electromagnetic lossy material and improvement was validated by TRP simulation and measurement.",

author = "Atieh Talebzadeh and Vuppunutala, {Pranay Kumar} and Kyoungchoul Koo and Hongyu Li and Jim Nadolny and Qian Liu and Jing Li and Kaustav Ghosh and Philippe Sochoux and Victor Khilkevich and Drewniak, {James L.} and Pommerenke, {David Johannes}",

year = "2019",

month = oct,

day = "22",

doi = "10.1109/TEMC.2019.2943290",

language = "English",

journal = "IEEE Transactions on Electromagnetic Compatibility",

issn = "0018-9375",

publisher = "Institute of Electrical and Electronics Engineers",

}

TY - JOUR

T1 - Coupling Path Visualization and EMI Mitigation for Flyover QSFP Connectors

AU - Talebzadeh, Atieh

AU - Vuppunutala, Pranay Kumar

AU - Koo, Kyoungchoul

AU - Li, Hongyu

AU - Nadolny, Jim

AU - Liu, Qian

AU - Li, Jing

AU - Ghosh, Kaustav

AU - Sochoux, Philippe

AU - Khilkevich, Victor

AU - Drewniak, James L.

AU - Pommerenke, David Johannes

PY - 2019/10/22

Y1 - 2019/10/22

N2 - In this article, the energy parcels concept is used to reveal radiation physics and coupling in the entire structure of flyover quad form-factor pluggable (QSFP) interconnection. Flyover QSFP has better signal integrity than legacy surface mounted printed circuit board QSFP technology. To understand electromagnetic interference aspects, a simulation model was built and correlated to measured total radiated power (TRP) for common mode and differential mode excitations for a frequency range of 1–40 GHz. Further, the energy parcels and their trajectories concept were applied to visualize the coupling path by tracking back the energy parcels from outside of the chassis (quiet side) toward a host board inside the chassis (noisy side). Then, high-density regions of energy parcel trajectories guide where to place the absorbing material efficiently and appropriately. Two locations were examined by filling them with electromagnetic lossy material and improvement was validated by TRP simulation and measurement.

AB - In this article, the energy parcels concept is used to reveal radiation physics and coupling in the entire structure of flyover quad form-factor pluggable (QSFP) interconnection. Flyover QSFP has better signal integrity than legacy surface mounted printed circuit board QSFP technology. To understand electromagnetic interference aspects, a simulation model was built and correlated to measured total radiated power (TRP) for common mode and differential mode excitations for a frequency range of 1–40 GHz. Further, the energy parcels and their trajectories concept were applied to visualize the coupling path by tracking back the energy parcels from outside of the chassis (quiet side) toward a host board inside the chassis (noisy side). Then, high-density regions of energy parcel trajectories guide where to place the absorbing material efficiently and appropriately. Two locations were examined by filling them with electromagnetic lossy material and improvement was validated by TRP simulation and measurement.

U2 - 10.1109/TEMC.2019.2943290

DO - 10.1109/TEMC.2019.2943290

M3 - Article

SN - 0018-9375

JO - IEEE Transactions on Electromagnetic Compatibility

JF - IEEE Transactions on Electromagnetic Compatibility

ER -