CreeSo – software for creep simulation of complex alloys

Gerold Zuderstorfer*, Florian Riedlsperger, Bernhard Sonderegger

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review


Summary: The MDC-model (Microstructural Dislocation Creep–model) is an advanced approach incorporating numerous creep mechanisms in complex alloys. It leads to a differential equation system that cannot be solved in a closed algebraic form. Also, some parameters of these equations cannot be measured directly. The application CreeSo (from ‘Creep Software’) helps finding numerical solutions of this model and it can also help determining missing parameters by comparing simulated with experimental creep curves. CreeSo is not limited to the MDC-model but open to any model formulated in its script language. The application is written in C++ and JavaScript and it will be available as a desktop version for MS-Windows and as an online version for web browsers.

Original languageEnglish
Pages (from-to)596-602
Number of pages7
JournalMaterials at High Temperatures
Issue number6
Early online date7 Apr 2022
Publication statusPublished - 2022


  • software
  • online
  • desktop
  • creep simulation
  • modelling
  • Software

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Ceramics and Composites
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry


Dive into the research topics of 'CreeSo – software for creep simulation of complex alloys'. Together they form a unique fingerprint.

Cite this