Design issues of BAW employment in 3D integrated sensor nodes

Josef Prainsack; Markus Dielacher; Martin Flatscher; Thomas Herndl; Rainer Matischek; Jörn Stolle; Werner Weber

doi:10.1007/s00542-009-0938-7

Design issues of BAW employment in 3D integrated sensor nodes

Josef Prainsack, Markus Dielacher, Martin Flatscher, Thomas Herndl, Rainer Matischek, Jörn Stolle, Werner Weber

Institute of Signal Processing and Speech Communication (4420)

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	1037-1043
Journal	Microsystem Technologies
Volume	16
Issue number	7
DOIs	https://doi.org/10.1007/s00542-009-0938-7
Publication status	Published - 2010

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10.1007/s00542-009-0938-7

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title = "Design issues of BAW employment in 3D integrated sensor nodes",

author = "Josef Prainsack and Markus Dielacher and Martin Flatscher and Thomas Herndl and Rainer Matischek and J{\"o}rn Stolle and Werner Weber",

year = "2010",

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journal = "Microsystem Technologies",

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T1 - Design issues of BAW employment in 3D integrated sensor nodes

AU - Prainsack, Josef

AU - Dielacher, Markus

AU - Flatscher, Martin

AU - Herndl, Thomas

AU - Matischek, Rainer

AU - Stolle, Jörn

AU - Weber, Werner

PY - 2010

Y1 - 2010

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UR - http://www.springerlink.com/content/911r082471425665/

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DO - 10.1007/s00542-009-0938-7

M3 - Article

SN - 1432-1858

VL - 16

SP - 1037

EP - 1043

JO - Microsystem Technologies

JF - Microsystem Technologies

IS - 7

ER -

Design issues of BAW employment in 3D integrated sensor nodes

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