Abstract
With increasing density of components in modern ICs, their electromagnetic compatibility (EMC) becomes more and more a design factor to consider. A lot of interference problems of electronic systems originate form high electromagnetic emission and low immunity of the used ICs. The so-called surface scan method provides a useful measurement technique to highlight origins of emissions
directly at the surface of IC packages or microchips. It is based on measuring electric- as well as magnetic near fields at the surface of ICs by automatically
moving a probe in 3 axis over the device. This technique enables the visualization of the distribution of E- and Hfields emitting from the surface of the device and thereby helps to identify and analyze emission hotspots.
directly at the surface of IC packages or microchips. It is based on measuring electric- as well as magnetic near fields at the surface of ICs by automatically
moving a probe in 3 axis over the device. This technique enables the visualization of the distribution of E- and Hfields emitting from the surface of the device and thereby helps to identify and analyze emission hotspots.
| Original language | English |
|---|---|
| Title of host publication | 15. EMV-Fachtagung |
| Subtitle of host publication | OVE Schriftenreihe Nr. 87 |
| Editors | Gunter Winkler |
| Place of Publication | Wien |
| Publisher | Österreichischer Verband für Elektrotechnik |
| Pages | 16 |
| Number of pages | 1 |
| Volume | 87 |
| ISBN (Print) | 3-85133-093-5 |
| Publication status | Published - 26 Apr 2017 |
Keywords
- EMC, Surface Scan, Emission, IC
ASJC Scopus subject areas
- Engineering(all)
Fields of Expertise
- Information, Communication & Computing