@inproceedings{b82cfb91b6b847f8ae0f6045fe112731,
title = "ESD susceptibility evaluation on capacitive fingerprint module",
abstract = "This paper reports on an investigation of ESD stresses on a fingerprint module. It shows that sparking to the flex connector, dielectric breakdown of the insulating layers, and transient electric and magnetic fields can cause damage. Test methods and simulation models are shown. An ESD generator and ESD field probe were used to expose the fingerprint module to currents and electromagnetic fields. Breakdown of the top insulating layer was observed. Damage due to ESD induced H-field injection occurred A 1 kŌ resistively grounded ring is proposed as an ESD protection solution for the fingerprint module system. Its effect on the discharge current is shown via simulation.",
keywords = "ESD Probes, Field Injection, Fingerprint module",
author = "Pengyu Wei and Shubhankar Marathe and Jianchi Zhou and David Pommerenke",
year = "2017",
month = oct,
day = "20",
doi = "10.1109/ISEMC.2017.8077862",
language = "English",
series = "IEEE International Symposium on Electromagnetic Compatibility",
publisher = "Institute of Electrical and Electronics Engineers",
pages = "175--180",
booktitle = "2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings",
address = "United States",
note = "2017 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity : EMCSI 2017 ; Conference date: 07-08-2017 Through 11-08-2017",
}