ESD susceptibility evaluation on capacitive fingerprint module

Pengyu Wei, Shubhankar Marathe, Jianchi Zhou, David Pommerenke

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review


This paper reports on an investigation of ESD stresses on a fingerprint module. It shows that sparking to the flex connector, dielectric breakdown of the insulating layers, and transient electric and magnetic fields can cause damage. Test methods and simulation models are shown. An ESD generator and ESD field probe were used to expose the fingerprint module to currents and electromagnetic fields. Breakdown of the top insulating layer was observed. Damage due to ESD induced H-field injection occurred A 1 kŌ resistively grounded ring is proposed as an ESD protection solution for the fingerprint module system. Its effect on the discharge current is shown via simulation.

Original languageEnglish
Title of host publication2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers
Number of pages6
ISBN (Electronic)9781538622308
Publication statusPublished - 20 Oct 2017
Externally publishedYes
Event2017 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity: EMCSI 2017 - Washington, United States
Duration: 7 Aug 201711 Aug 2017

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118


Conference2017 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity
Country/TerritoryUnited States


  • ESD Probes
  • Field Injection
  • Fingerprint module

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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