Influence of an extended stub at connector ports on signal launches and TRL de-embedding

Jianmin Zhang*, James L. Drewniak, David J. Pommerenke, Bruce Archambeault, Zhiping Yang, Wheling Cheng, John Fisher, Sergio Camerlo

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review


Characterization of PCBs (Printed Circuit Boards) is usually associated with measurement using a VNA (Vector Network Analyzer) in the frequency-domain or a TDR (Time Domain Reflectometer) in the time-domain. The often used signal launch techniques on PCBs based on the VNA or TDR measurement in the microwave frequency range use SMA or 3.5 mm connectors, in edge-launch or vertical-launch fashions. The signal transition between the launch port and the DUT (Device Under Test) introduces errors in the measurement, which is dominant when compared with a transmission line itself on the PCB as the technologies of PCB manufacturing well developed today. Discontinuities at connector ports depend on the port structures and the dielectric properties of the substrate materials. However, an extended stub at a connector port may significantly influence signal launches, or even corrupt a TRL calibration in a measurement.

Original languageEnglish
Title of host publication2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
Number of pages6
Publication statusPublished - 1 Dec 2006
Externally publishedYes
Event2006 IEEE International Symposium on Electromagnetic Compatibility: EMC 2006 - Portland, United States
Duration: 14 Aug 200618 Aug 2006

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076


Conference2006 IEEE International Symposium on Electromagnetic Compatibility
Country/TerritoryUnited States


  • Port launch techniques
  • TDR measurement
  • TRL de-embedding
  • VNA measurement

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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