Activities per year
Abstract
In this work we examine the electromagnetic interference (EMI) behaviour of EMI improved integrated folded cascode amplifier input stages. We compare three EMI improved differential input pair structures in this context. These structures use the concept of compensation to decrease EMI susceptibility. We put special focus on the behavioural differences in the structures at the design stage and the layout stage. In this we consider layout-specific parasitics that may affect circuit performance. The performance parameters include EMI induced offset voltage, electromagnetic interference rejection ratio (EMIRR), layout considerations, differential and common mode gain, gainbandwidth product (GBWP), stability, power consumption and area requirement (estimation vs. implementation).
Original language | English |
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Title of host publication | 2021 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 9-12 |
Number of pages | 4 |
ISBN (Electronic) | 9781665423809 |
DOIs | |
Publication status | Published - 9 Mar 2022 |
Event | 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits: EMC Compo 2021 - Virtuell, Austria Duration: 9 Mar 2022 → 11 Mar 2022 |
Conference
Conference | 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits |
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Country/Territory | Austria |
City | Virtuell |
Period | 9/03/22 → 11/03/22 |
Keywords
- electromagnetic interference
- operational amplifier
- EMI improved
- EMI robustness
- folded cascode
- EMI induced offset
- differential input pair
- integrated circuit design
- layout
- compensation
ASJC Scopus subject areas
- Safety, Risk, Reliability and Quality
- Electrical and Electronic Engineering
- Radiation
Fingerprint
Dive into the research topics of 'Influence of Layout Parasitics on EMI Improved Folded Cascode Amplifier Input Stages Using Compensation Methods'. Together they form a unique fingerprint.Activities
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13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
Dominik Zupan (Participant), Nikolaus Czepl (Participant), Daniel Kircher (Participant) & Bernd Deutschmann (Participant)
9 Mar 2022 → 11 Mar 2022Activity: Participation in or organisation of › Conference or symposium (Participation in/Organisation of)
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Influence of Layout Parasitics on EMI Improved Folded Cascode Amplifier Input Stages Using Compensation Methods
Dominik Zupan (Speaker) & Nikolaus Czepl (Speaker)
9 Mar 2022Activity: Talk or presentation › Talk at conference or symposium › Science to science
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Layout Parasitics on EMI Improved Folded Cascode Amplifier Input Stages (Compensation)
Dominik Zupan (Speaker) & Nikolaus Czepl (Speaker)
9 Mar 2022Activity: Public engagement › Participation in TV / radio programme or webbased media