Method for Producing a Copper Layer on a Semiconductor Body Using a Printing Process

Markus Heinrici (Inventor), Martin Mischitz (Inventor), Manfred Schneegans (Inventor)

Research output: Patent

Original languageGerman
Patent numberUS 20150214095 A1
Publication statusPublished - 30 Jul 2015

Fields of Expertise

  • Advanced Materials Science

Cite this