Model-Based Temperature Control in Thermal Processing of Silicon Wafers

Stefan Koch, Alexander Schaum, Martin Kleindienst, Markus Reichhartinger, Thomas Meurer, Jaime A. Moreno, Martin Horn

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review

Abstract

The paper proposes a model-based control approach for thermal processing of silicon wafers such as rapid thermal processing. Heating of the wafer is achieved with a large number of high-power LEDs which enable targeted heating over the entire spatial domain. Taking advantage of this feature, a distributed PI controller is first designed assuming an idealized distributed input. This control signal is then approximated by the actual control that enters the system through shape functions using an optimization procedure. A formal analysis of the input-to-state stability with respect to the actuator error, extension with an anti-windup scheme and an experimental validation of the proposed approach are presented.
Original languageEnglish
Title of host publication4th IFAC Workshop on Control of Systems Governed by Partial Differential Equations CPDE 2022
Pages180-186
Number of pages7
Volume55
Edition26
DOIs
Publication statusPublished - 2022
Event4th IFAC Workshop on Control of Systems Governed by Partial Differential Equations - Kiel, Germany
Duration: 5 Sept 20227 Sept 2022
http://cpde2022.org/

Publication series

NameIFAC-PapersOnLine

Conference

Conference4th IFAC Workshop on Control of Systems Governed by Partial Differential Equations
Abbreviated titleCPDE
Country/TerritoryGermany
CityKiel
Period5/09/227/09/22
Internet address

Keywords

  • Anti-windup
  • Distributed-parameter systems
  • Input-to-state stability
  • Manufacturing processes
  • Model-based control
  • Temperature control

ASJC Scopus subject areas

  • Control and Systems Engineering

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