Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies

Arash Arsanjani; Ziad Hatab; Ahmad Bader Alothman Alterkawi; Michael Ernst Gadringer; Wolfgang Bösch

doi:10.1109/ARFTG61196.2024.10660794

Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies

Arash Arsanjani, Ziad Hatab, Ahmad Bader Alothman Alterkawi, Michael Ernst Gadringer, Wolfgang Bösch

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

This paper explores the potential of the modified semi-additive process (mSAP) for precise manufacturing and measurement of structures on printed circuit boards (PCBs), with a particular emphasis on high-frequency applications. One example discussed in this paper is the measurement of a substrate-integrated waveguide (SIW) loaded with mushroom metasurface unitcells. Given the high sensitivity of metasurface structures to fabrication errors, this serves as a relevant case study. Our invetigation includes a detailed evaluation, incorporating X-ray analysis, a cross-sectional analysis, and S-parameters measurements up to 150 GHz using customized multiline thru-reflect-line (TRL) with uncertainty analysis. The measurement results show strongly agree with electromagnetic(EM) simulation, highlighting the suitability of mSAP technology for accurate fabrication and enabling measurement of high-frequency devices.

Original language	English
Title of host publication	103rd ARFTG Microwave Measurement Conference
Subtitle of host publication	Advanced Measurement Techniques for Next-G Communication Systems, ARFTG 2024
Publisher	IEEE CSP
Number of pages	4
ISBN (Electronic)	9798350362732
ISBN (Print)	979-8-3503-6274-9
DOIs	https://doi.org/10.1109/ARFTG61196.2024.10660794
Publication status	Published - 21 Jun 2024
Event	103rd ARFTG Microwave Measurement Conference: ARFTG 2024 - Washington, DC, United States Duration: 21 Jun 2024 → 21 Jun 2024

Conference

Conference	103rd ARFTG Microwave Measurement Conference
Country/Territory	United States
City	Washington, DC
Period	21/06/24 → 21/06/24

Keywords

calibration
metasurface
microwave measurement
millimeter-wave
modifieds semi-additive process
printed circuit board
sub-terahertz
subtractive manufacturing

ASJC Scopus subject areas

Electrical and Electronic Engineering
Instrumentation
Signal Processing
Computer Networks and Communications

Fields of Expertise

Information, Communication & Computing

Treatment code (Nähere Zuordnung)

Experimental

Access to Document

10.1109/ARFTG61196.2024.10660794

Cite this

Arsanjani, A., Hatab, Z., Alterkawi, A. B. A., Gadringer, M. E., & Bösch, W. (2024). Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies. In 103rd ARFTG Microwave Measurement Conference: Advanced Measurement Techniques for Next-G Communication Systems, ARFTG 2024 Article 10660794 IEEE CSP. https://doi.org/10.1109/ARFTG61196.2024.10660794

Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies. / Arsanjani, Arash; Hatab, Ziad; Alterkawi, Ahmad Bader Alothman et al.
103rd ARFTG Microwave Measurement Conference: Advanced Measurement Techniques for Next-G Communication Systems, ARFTG 2024. IEEE CSP, 2024. 10660794.

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Arsanjani, A, Hatab, Z, Alterkawi, ABA, Gadringer, ME & Bösch, W 2024, Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies. in 103rd ARFTG Microwave Measurement Conference: Advanced Measurement Techniques for Next-G Communication Systems, ARFTG 2024., 10660794, IEEE CSP, 103rd ARFTG Microwave Measurement Conference, Washington, DC, United States, 21/06/24. https://doi.org/10.1109/ARFTG61196.2024.10660794

Arsanjani A, Hatab Z, Alterkawi ABA, Gadringer ME , Bösch W. Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies. In 103rd ARFTG Microwave Measurement Conference: Advanced Measurement Techniques for Next-G Communication Systems, ARFTG 2024. IEEE CSP. 2024. 10660794 doi: 10.1109/ARFTG61196.2024.10660794

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title = "Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies",

abstract = "This paper explores the potential of the modified semi-additive process (mSAP) for precise manufacturing and measurement of structures on printed circuit boards (PCBs), with a particular emphasis on high-frequency applications. One example discussed in this paper is the measurement of a substrate-integrated waveguide (SIW) loaded with mushroom metasurface unitcells. Given the high sensitivity of metasurface structures to fabrication errors, this serves as a relevant case study. Our invetigation includes a detailed evaluation, incorporating X-ray analysis, a cross-sectional analysis, and S-parameters measurements up to 150 GHz using customized multiline thru-reflect-line (TRL) with uncertainty analysis. The measurement results show strongly agree with electromagnetic(EM) simulation, highlighting the suitability of mSAP technology for accurate fabrication and enabling measurement of high-frequency devices.",

keywords = "Microwave measurement, Fabrication, Accuracy, Uncertainty, Millimeter wave measurements, Printed circuits, Measurement uncertainty, calibration, metasurface, microwave measurement, millimeter-wave, modifieds semi-additive process, printed circuit board, sub-terahertz, subtractive manufacturing",

author = "Arash Arsanjani and Ziad Hatab and Alterkawi, {Ahmad Bader Alothman} and Gadringer, {Michael Ernst} and Wolfgang B{\"o}sch",

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doi = "10.1109/ARFTG61196.2024.10660794",

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AU - Arsanjani, Arash

AU - Hatab, Ziad

AU - Alterkawi, Ahmad Bader Alothman

AU - Gadringer, Michael Ernst

AU - Bösch, Wolfgang

PY - 2024/6/21

Y1 - 2024/6/21

N2 - This paper explores the potential of the modified semi-additive process (mSAP) for precise manufacturing and measurement of structures on printed circuit boards (PCBs), with a particular emphasis on high-frequency applications. One example discussed in this paper is the measurement of a substrate-integrated waveguide (SIW) loaded with mushroom metasurface unitcells. Given the high sensitivity of metasurface structures to fabrication errors, this serves as a relevant case study. Our invetigation includes a detailed evaluation, incorporating X-ray analysis, a cross-sectional analysis, and S-parameters measurements up to 150 GHz using customized multiline thru-reflect-line (TRL) with uncertainty analysis. The measurement results show strongly agree with electromagnetic(EM) simulation, highlighting the suitability of mSAP technology for accurate fabrication and enabling measurement of high-frequency devices.

AB - This paper explores the potential of the modified semi-additive process (mSAP) for precise manufacturing and measurement of structures on printed circuit boards (PCBs), with a particular emphasis on high-frequency applications. One example discussed in this paper is the measurement of a substrate-integrated waveguide (SIW) loaded with mushroom metasurface unitcells. Given the high sensitivity of metasurface structures to fabrication errors, this serves as a relevant case study. Our invetigation includes a detailed evaluation, incorporating X-ray analysis, a cross-sectional analysis, and S-parameters measurements up to 150 GHz using customized multiline thru-reflect-line (TRL) with uncertainty analysis. The measurement results show strongly agree with electromagnetic(EM) simulation, highlighting the suitability of mSAP technology for accurate fabrication and enabling measurement of high-frequency devices.

KW - Microwave measurement

KW - Fabrication

KW - Accuracy

KW - Uncertainty

KW - Millimeter wave measurements

KW - Printed circuits

KW - Measurement uncertainty

KW - calibration

KW - metasurface

KW - microwave measurement

KW - millimeter-wave

KW - modifieds semi-additive process

KW - printed circuit board

KW - sub-terahertz

KW - subtractive manufacturing

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U2 - 10.1109/ARFTG61196.2024.10660794

DO - 10.1109/ARFTG61196.2024.10660794

M3 - Conference paper

SN - 979-8-3503-6274-9

BT - 103rd ARFTG Microwave Measurement Conference

PB - IEEE CSP

T2 - 103rd ARFTG Microwave Measurement Conference

Y2 - 21 June 2024 through 21 June 2024

ER -

Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies

Abstract

Conference

Keywords

ASJC Scopus subject areas

Fields of Expertise

Treatment code (Nähere Zuordnung)

Access to Document

Other files and links

CD-Laboratory for Technology guided electronic component design and characterization

A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss

Experimental analysis of grounded coplanar waveguide structures based on different PCB processes with uncertainty analysis

Propagation of Linear Uncertainties through Multiline Thru-Reflect-Line Calibration

Cite this

Modified Semi-Additive Manufacturing of PCBs for Enabling Accurate Device Measurements at Millimeter-Wave and Sub-Terahertz Frequencies

Abstract

Conference

Keywords

ASJC Scopus subject areas

Fields of Expertise

Treatment code (Nähere Zuordnung)

Access to Document

Other files and links

Projects

CD-Laboratory for Technology guided electronic component design and characterization

Research output

A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss

Experimental analysis of grounded coplanar waveguide structures based on different PCB processes with uncertainty analysis

Propagation of Linear Uncertainties through Multiline Thru-Reflect-Line Calibration

Cite this