PCB RF probe landing pads for multiline deembedding

Sebastian Sattler; Michael Ernst Gadringer; Fabrizio Gentili; Ahmad Bader Alothman Alterkawi; Wolfgang Bösch

doi:10.1109/PRIME.2017.7974144

PCB RF probe landing pads for multiline deembedding

Sebastian Sattler, Michael Ernst Gadringer, Fabrizio Gentili, Ahmad Bader Alothman Alterkawi, Wolfgang Bösch

Research output: Contribution to conference › Paper › peer-review

Abstract

The interface between a probe station and an active or passive component on a printed circuit board is of great importance for RF systems operating in the mm-wave frequency range. The landing pads provide the transition between a coplanar measurement device and a microstrip interface. This paper addresses the design issues of such landing pads focusing on finding the optimal design enabling multiline deembedding with a measurement error better than 0.1dB.

Original language	English
Pages	209 - 212
DOIs	https://doi.org/10.1109/PRIME.2017.7974144
Publication status	Published - 30 Jun 2017
Event	13th Conference on Ph.D. Research in Microelectronics and Electronics: PRIME 2017 - Giardini Naxos, Taormina, Italy Duration: 12 Jun 2017 → 15 Jul 2017 http://prime2017.unisa.it/

Conference

Conference	13th Conference on Ph.D. Research in Microelectronics and Electronics
Abbreviated title	Prime 2017
Country/Territory	Italy
City	Taormina
Period	12/06/17 → 15/07/17
Internet address	http://prime2017.unisa.it/

Fields of Expertise

Information, Communication & Computing

Treatment code (Nähere Zuordnung)

Experimental

Access to Document

10.1109/PRIME.2017.7974144

Cite this

@conference{1ee45f73af864da2a73997974ff69ac2,

title = "PCB RF probe landing pads for multiline deembedding",

abstract = "The interface between a probe station and an active or passive component on a printed circuit board is of great importance for RF systems operating in the mm-wave frequency range. The landing pads provide the transition between a coplanar measurement device and a microstrip interface. This paper addresses the design issues of such landing pads focusing on finding the optimal design enabling multiline deembedding with a measurement error better than 0.1dB.",

keywords = "Hochfrequenztechnik, Messtechnik, On-Wafer Messtechnik, Waferprober, PCB",

author = "Sebastian Sattler and Gadringer, {Michael Ernst} and Fabrizio Gentili and {Alothman Alterkawi}, {Ahmad Bader} and Wolfgang B{\"o}sch",

year = "2017",

month = jun,

day = "30",

doi = "10.1109/PRIME.2017.7974144",

language = "English",

pages = "209 -- 212",

note = "13th Conference on Ph.D. Research in Microelectronics and Electronics : PRIME 2017, Prime 2017 ; Conference date: 12-06-2017 Through 15-07-2017",

url = "http://prime2017.unisa.it/",

}

TY - CONF

T1 - PCB RF probe landing pads for multiline deembedding

AU - Sattler, Sebastian

AU - Gadringer, Michael Ernst

AU - Gentili, Fabrizio

AU - Alothman Alterkawi, Ahmad Bader

AU - Bösch, Wolfgang

PY - 2017/6/30

Y1 - 2017/6/30

N2 - The interface between a probe station and an active or passive component on a printed circuit board is of great importance for RF systems operating in the mm-wave frequency range. The landing pads provide the transition between a coplanar measurement device and a microstrip interface. This paper addresses the design issues of such landing pads focusing on finding the optimal design enabling multiline deembedding with a measurement error better than 0.1dB.

AB - The interface between a probe station and an active or passive component on a printed circuit board is of great importance for RF systems operating in the mm-wave frequency range. The landing pads provide the transition between a coplanar measurement device and a microstrip interface. This paper addresses the design issues of such landing pads focusing on finding the optimal design enabling multiline deembedding with a measurement error better than 0.1dB.

KW - Hochfrequenztechnik

KW - Messtechnik

KW - On-Wafer Messtechnik

KW - Waferprober

KW - PCB

UR - http://ieeexplore.ieee.org/document/7974144/

U2 - 10.1109/PRIME.2017.7974144

DO - 10.1109/PRIME.2017.7974144

M3 - Paper

SP - 209

EP - 212

T2 - 13th Conference on Ph.D. Research in Microelectronics and Electronics

Y2 - 12 June 2017 through 15 July 2017

ER -

PCB RF probe landing pads for multiline deembedding

Abstract

Conference

Fields of Expertise

Treatment code (Nähere Zuordnung)

Access to Document

Other files and links

SeCoS - Secure Contactless Sphere - Smart RFID-Technologies for a Connected World

Cite this

PCB RF probe landing pads for multiline deembedding

Abstract

Conference

Fields of Expertise

Treatment code (Nähere Zuordnung)

Access to Document

Other files and links

Projects

SeCoS - Secure Contactless Sphere - Smart RFID-Technologies for a Connected World

Cite this