TY - GEN
T1 - Sheet absorbing material modeling and application for enclosures
AU - Radchenko, Andriy
AU - Bishop, Joseph
AU - Johnson, Richard
AU - Dixon, Paul
AU - Koledintseva, Marina
AU - Jobava, Roman
AU - Pommerenke, David
AU - Drewniak, James
PY - 2013/12/1
Y1 - 2013/12/1
N2 - This paper demonstrates relevant physics and provides recommendations regarding thin sheet absorber material applications in enclosures of electronic circuitry. Sheet absorbers placed on the walls of an enclosure are studied herein both experimentally and through the full-wave numerical simulations. In practical applications, the applied absorbing patches need to be selected in terms of proper material type, thickness, size, and placement within an enclosure. The goal is to achieve the maximum effectiveness to suppress electromagnetic field at problem resonances in the enclosure.
AB - This paper demonstrates relevant physics and provides recommendations regarding thin sheet absorber material applications in enclosures of electronic circuitry. Sheet absorbers placed on the walls of an enclosure are studied herein both experimentally and through the full-wave numerical simulations. In practical applications, the applied absorbing patches need to be selected in terms of proper material type, thickness, size, and placement within an enclosure. The goal is to achieve the maximum effectiveness to suppress electromagnetic field at problem resonances in the enclosure.
UR - http://www.scopus.com/inward/record.url?scp=84893188713&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.2013.6670491
DO - 10.1109/ISEMC.2013.6670491
M3 - Conference paper
AN - SCOPUS:84893188713
SN - 9781479904082
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 645
EP - 650
BT - Proceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
T2 - 2013 IEEE International Symposium on Electromagnetic Compatibility
Y2 - 5 August 2013 through 9 August 2013
ER -