Simple Dflip-flop Behavioral Model of ESD Immunity for use in the ISO 10605 Standard

Guangyao Shen; V Khilkevich; S Yang; D Pommerenke; H Aichele; D Eichel; C Keller

Simple Dflip-flop Behavioral Model of ESD Immunity for use in the ISO 10605 Standard

Guangyao Shen^*, V Khilkevich, S Yang, D Pommerenke, H Aichele, D Eichel, C Keller

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

As the ESD stress is becoming more and more important for integrated circuits (ICs), the ability to predict IC failures becomes critical. In this paper, an 18 MHz D flip-flop IC is characterized and its behavioral model is presented. The resulting IC model is validated in the setup according to the ISO 10605 standard. A complete model of the setup combining the IC behavioral model and the passive parts of the setup is built to estimate the failure prediction accuracy in a totally simulated environment. The results show that the model can predict the triggering level with the error of less than 20%.

Original language	English
Title of host publication	2014 IEEE International Symposium on Electromagnetic Compatibility, EMC
Pages	455-459
Number of pages	5
Publication status	Published - 1 Jan 2014
Externally published	Yes
Event	2014 IEEE International Symposium on Electromagnetic Compatibility: EMC 2014 - Raleigh, United States Duration: 3 Aug 2014 → 8 Aug 2014

Conference

Conference	2014 IEEE International Symposium on Electromagnetic Compatibility
Country/Territory	United States
City	Raleigh
Period	3/08/14 → 8/08/14

Cite this

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title = "Simple Dflip-flop Behavioral Model of ESD Immunity for use in the ISO 10605 Standard",

abstract = "As the ESD stress is becoming more and more important for integrated circuits (ICs), the ability to predict IC failures becomes critical. In this paper, an 18 MHz D flip-flop IC is characterized and its behavioral model is presented. The resulting IC model is validated in the setup according to the ISO 10605 standard. A complete model of the setup combining the IC behavioral model and the passive parts of the setup is built to estimate the failure prediction accuracy in a totally simulated environment. The results show that the model can predict the triggering level with the error of less than 20%.",

author = "Guangyao Shen and V Khilkevich and S Yang and D Pommerenke and H Aichele and D Eichel and C Keller",

year = "2014",

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language = "English",

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T1 - Simple Dflip-flop Behavioral Model of ESD Immunity for use in the ISO 10605 Standard

AU - Shen, Guangyao

AU - Khilkevich, V

AU - Yang, S

AU - Pommerenke, D

AU - Aichele, H

AU - Eichel, D

AU - Keller, C

PY - 2014/1/1

Y1 - 2014/1/1

N2 - As the ESD stress is becoming more and more important for integrated circuits (ICs), the ability to predict IC failures becomes critical. In this paper, an 18 MHz D flip-flop IC is characterized and its behavioral model is presented. The resulting IC model is validated in the setup according to the ISO 10605 standard. A complete model of the setup combining the IC behavioral model and the passive parts of the setup is built to estimate the failure prediction accuracy in a totally simulated environment. The results show that the model can predict the triggering level with the error of less than 20%.

AB - As the ESD stress is becoming more and more important for integrated circuits (ICs), the ability to predict IC failures becomes critical. In this paper, an 18 MHz D flip-flop IC is characterized and its behavioral model is presented. The resulting IC model is validated in the setup according to the ISO 10605 standard. A complete model of the setup combining the IC behavioral model and the passive parts of the setup is built to estimate the failure prediction accuracy in a totally simulated environment. The results show that the model can predict the triggering level with the error of less than 20%.

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M3 - Conference paper

SP - 455

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BT - 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC

T2 - 2014 IEEE International Symposium on Electromagnetic Compatibility

Y2 - 3 August 2014 through 8 August 2014

ER -

Simple Dflip-flop Behavioral Model of ESD Immunity for use in the ISO 10605 Standard

Abstract

Conference

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