Abstract
Moisture sorption of microelectronics packages may lead to plasticization of materials such as epoxide-based transfer-molding compounds. This does not only result in a reduction of the modulus but also to a change in the frequency response of the materials. In this work, moisture-induced plasticization effects of unfilled transparent molding compounds are modeled using finite-element reliability simulations of an optical sensor package. Storage modulus data from humidity-controlled dynamic mechanical analysis is used to extend the temperature-dependent linear viscoelastic constitutive model, usually applied using a Prony series and time - temperature superposition, to apply a previously presented time - temperature - moisture concentration superposition of viscoelastic relaxation time-constants. Eventually, stress fields at the die-to-mold compound interface resulting from thermal and hygroscopic strains are compared, applying different complexity of the constitutive model of the compound.
Original language | English |
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Title of host publication | IEEE 71st Electronic Components and Technology Conference, ECTC 2021 |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 989-994 |
Number of pages | 6 |
ISBN (Electronic) | 9780738145235 |
DOIs | |
Publication status | Published - 2021 |
Event | 71st IEEE Electronic Components and Technology Conference: ECTC 2021 - Virtual, Online, United States Duration: 1 Jun 2021 → 4 Jul 2021 |
Conference
Conference | 71st IEEE Electronic Components and Technology Conference |
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Country/Territory | United States |
City | Virtual, Online |
Period | 1/06/21 → 4/07/21 |
Keywords
- Microelectronics packaging
- Modeling of moisture
- Moisture concentration superposition
- Plasticization
- Temperature
- Time
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering