Simulation of moisture-induced plasticization in transfer-molded optical sensor packages using a time - temperature - moisture concentration superposition

Fabian Huber, Harald Etschmaier, Peter Hadley

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review

Abstract

Moisture sorption of microelectronics packages may lead to plasticization of materials such as epoxide-based transfer-molding compounds. This does not only result in a reduction of the modulus but also to a change in the frequency response of the materials. In this work, moisture-induced plasticization effects of unfilled transparent molding compounds are modeled using finite-element reliability simulations of an optical sensor package. Storage modulus data from humidity-controlled dynamic mechanical analysis is used to extend the temperature-dependent linear viscoelastic constitutive model, usually applied using a Prony series and time - temperature superposition, to apply a previously presented time - temperature - moisture concentration superposition of viscoelastic relaxation time-constants. Eventually, stress fields at the die-to-mold compound interface resulting from thermal and hygroscopic strains are compared, applying different complexity of the constitutive model of the compound.

Original languageEnglish
Title of host publicationIEEE 71st Electronic Components and Technology Conference, ECTC 2021
PublisherInstitute of Electrical and Electronics Engineers
Pages989-994
Number of pages6
ISBN (Electronic)9780738145235
DOIs
Publication statusPublished - 2021
Event71st IEEE Electronic Components and Technology Conference: ECTC 2021 - Virtual, Online, United States
Duration: 1 Jun 20214 Jul 2021

Conference

Conference71st IEEE Electronic Components and Technology Conference
Country/TerritoryUnited States
CityVirtual, Online
Period1/06/214/07/21

Keywords

  • Microelectronics packaging
  • Modeling of moisture
  • Moisture concentration superposition
  • Plasticization
  • Temperature
  • Time

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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