Synchronization of time-of-flight 3D sensors for optical communication

Hannes Plank, Armin Schoenlieb, Christoph Ehrenhoefer, Christian Steger, Gerald Holweg, Norbert Druml

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review


Time-of-Flight 3D imaging systems are promising transceivers for image sensor based optical communication. 3D sensing based on Time-of-Flight is the most miniaturized depth imaging technology available and is currently being integrated into consumer electronics such as smart phones. Optical line-of-sight communication with a depth imaging system offers complete location-awareness of the communication partner. This enables new opportunities in fields like secure authentication, augmented reality or vehicle to vehicle communication. We show how Time-of-Flight systems are capable of using phase shift keying of pulsed light (PLPSK) to transmit data over a line-of-sight connection. PLPSK is still unexplored in the domain of image sensors and enables Time-of-Flight sensors to transmit multiple bits per frame at rates of over 7 kHz. A serious problem however are asynchronous modulation signals, causing frequent transmission errors and impairing proper communication. In this work, we formulate and discuss the severity of the problem and propose a synchronization procedure. We evaluate our solution with a prototype system, and show that it is possible to reach a synchronization success rate of nearly 100% over a distance of 9 meter.

Original languageEnglish
Title of host publication2017 IEEE International Conference on Communications, ICC 2017
PublisherInstitute of Electrical and Electronics Engineers
Number of pages6
ISBN (Electronic)9781467389990
Publication statusPublished - 28 Jul 2017
Event2017 IEEE International Conference on Communications, ICC 2017 - Paris, France
Duration: 21 May 201725 May 2017


Conference2017 IEEE International Conference on Communications, ICC 2017

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering


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