Thermal Performance of Plastic-Encapsulated and Hermetically Sealed Components for Automotive Applications

L. Musiejovsky; Hans Hauser; Johann Nicolics; Georg Brasseur

doi:10.1109/IMTC.1998.676911

Thermal Performance of Plastic-Encapsulated and Hermetically Sealed Components for Automotive Applications

L. Musiejovsky, Hans Hauser, Johann Nicolics, Georg Brasseur

Institute of Electrical Measurement and Sensor Systems (4530)

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

In automotive applications reliability and lifetime of electronic components are mainly influenced by aging processes related to superposing effects of mechanical vibrations, thermomechanically induced stress and thermal load. Two of these factors can be minimized by optimizing the component's thermal design. In this work measured and simulated thermal qualities of plastic-encapsulated and ceramic packages are compared. The experimental test procedure and main features of a new thermal simulation tool especially designed for the prediction of thermal characteristics of mono-chip and multi-chip components are discussed. Although, the thermal conductivity of ceramic is high compared to plastic moldings our results clearly show that plastic packages can compete with their ceramic counterparts.

Original language	English
Title of host publication	IEEE Proceedings on Instrumentation and Measurement Technology (IMTC/98)
Place of Publication	St. Paul, Minnesota
Pages	1185-1188
DOIs	https://doi.org/10.1109/IMTC.1998.676911
Publication status	Published - 20 May 1998

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10.1109/IMTC.1998.676911

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Thermal Performance of Plastic-Encapsulated and Hermetically Sealed Components for Automotive Applications. / Musiejovsky, L.; Hauser, Hans; Nicolics, Johann et al.
IEEE Proceedings on Instrumentation and Measurement Technology (IMTC/98). St. Paul, Minnesota, 1998. p. 1185-1188.

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

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N2 - In automotive applications reliability and lifetime of electronic components are mainly influenced by aging processes related to superposing effects of mechanical vibrations, thermomechanically induced stress and thermal load. Two of these factors can be minimized by optimizing the component's thermal design. In this work measured and simulated thermal qualities of plastic-encapsulated and ceramic packages are compared. The experimental test procedure and main features of a new thermal simulation tool especially designed for the prediction of thermal characteristics of mono-chip and multi-chip components are discussed. Although, the thermal conductivity of ceramic is high compared to plastic moldings our results clearly show that plastic packages can compete with their ceramic counterparts.

AB - In automotive applications reliability and lifetime of electronic components are mainly influenced by aging processes related to superposing effects of mechanical vibrations, thermomechanically induced stress and thermal load. Two of these factors can be minimized by optimizing the component's thermal design. In this work measured and simulated thermal qualities of plastic-encapsulated and ceramic packages are compared. The experimental test procedure and main features of a new thermal simulation tool especially designed for the prediction of thermal characteristics of mono-chip and multi-chip components are discussed. Although, the thermal conductivity of ceramic is high compared to plastic moldings our results clearly show that plastic packages can compete with their ceramic counterparts.

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ER -

Thermal Performance of Plastic-Encapsulated and Hermetically Sealed Components for Automotive Applications

Abstract

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