Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices: Automated assembly of miniaturized PM sensor

Jaka Pribosek, Markus Zauner, Jochen Bardong, Alfred Binder, Paul Maierhofer, Alexander Bergmann, Georg Rohrer

    Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review


    In this paper we propose the selective adhesive bonding technique using contact imprinting from thin adhesive layers spin-coated on the sacrificial polyethylene foils. The imprinting is assisted with vacuum release of the polymer foil to reduce the pull-off adhesive force and prevent sticking, posing less constraints on the required lifting force. We apply this method in assembly of a highly integrated optical particle counter confronted with several strict assembly requirements, such as selective bonding with small feature size (<200 μm), minimal adhesive thicknesses (<15μm), precise out-of plane tolerances, low adhesive squeeze-out and hermetically sealed packaging. A successful selective adhesive bonding with ratio of vacuum tool area to adhesive contact area of 1:20 was demonstrated.

    Original languageEnglish
    Title of host publication2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings
    PublisherInstitute of Electrical and Electronics Engineers
    ISBN (Electronic)9781728116341
    Publication statusPublished - 1 Oct 2019
    Event18th IEEE Sensors Conference: SENSORS 2019 - Montreal, Canada
    Duration: 27 Oct 201930 Oct 2019

    Publication series

    NameProceedings of IEEE Sensors
    ISSN (Print)1930-0395
    ISSN (Electronic)2168-9229


    Conference18th IEEE Sensors Conference


    • heterogeneous integration
    • MEMS
    • MOEMS
    • optical particle counter
    • PM2.5
    • selective adhesive bonding

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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