@inproceedings{0f5aad7f732d40eb82c0524511dbb062,
title = "Volcano effect in open through silicon via (TSV) technology",
author = "J. Kraft and E. St{\"u}ckler and C. Cassidy and W. Niko and F. Schrank and E. Wachmann and Christian Gspan and Ferdinand Hofer",
year = "2012",
doi = "10.1109/IRPS.2012.6241924",
language = "English",
isbn = "978-1-4577-1678-2",
pages = "PI2.1--PI2.5",
booktitle = "2012 IEEE International Reliability Physics Symposium",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",
note = "IEEE International Reliability Physics Symposium ; Conference date: 15-04-2012 Through 19-04-2012",
}