Wire-Bonding on Porous Copper Layers obtained from Printed Pastes

Markus Heinrici

Research output: Contribution to conference › Poster

Original languageEnglish
Publication statusPublished - 2015
EventInfineon Innovation Week 2014 University Event - München
Duration: 12 Nov 2015 → …

Conference

ConferenceInfineon Innovation Week 2014 University Event
CityMünchen
Period12/11/15 → …

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Application

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