A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss

Ziad Hatab; Hiroaki Takahashi; Ahmad Bader Alothman Alterkawi; Michael Ernst Gadringer; Wolfgang Bösch

doi:10.23919/EuMC58039.2023.10290259

A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss

Ziad Hatab, Hiroaki Takahashi, Ahmad Bader Alothman Alterkawi, Michael Ernst Gadringer, Wolfgang Bösch

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Abstract

This study proposes an innovative design approach for layer transitions in printed circuit boards (PCBs) using microvia structures. Instead of treating microvias as vertical structures, we approached the analysis of microvias as a segment of a thick planar transmission line using quasi-TEM (transverse electromagnetic) analysis. The proposed design approach is shown to be effective for microstrip to embedded grounded coplanar waveguide (GCPW), microstrip to embedded microstrip, and microstrip to stripline transitions. The fabricated structures have been measured and show excellent return loss performance, achieving better than -15 dB for frequencies up to 150 GHz.

Originalsprache	englisch
Titel	2023 53rd European Microwave Conference, EuMC 2023
Herausgeber (Verlag)	ACM/IEEE
Seiten	62-65
Seitenumfang	4
ISBN (elektronisch)	9782874870729
ISBN (Print)	979-8-3503-4739-5
DOIs	https://doi.org/10.23919/EuMC58039.2023.10290259
Publikationsstatus	Veröffentlicht - 21 Sept. 2023
Veranstaltung	53rd European Microwave Conference: EuMC 2023 - Berlin, Deutschland Dauer: 19 Sept. 2023 → 21 Sept. 2023

Konferenz

Konferenz	53rd European Microwave Conference
Land/Gebiet	Deutschland
Ort	Berlin
Zeitraum	19/09/23 → 21/09/23

ASJC Scopus subject areas

Elektrotechnik und Elektronik
Elektronische, optische und magnetische Materialien
Instrumentierung
Computernetzwerke und -kommunikation

Fields of Expertise

Information, Communication & Computing

Treatment code (Nähere Zuordnung)

Experimental

Zugriff auf Dokument

10.23919/EuMC58039.2023.10290259

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10290259

Andere Dateien und Links

1 Laufend

CD-Labor für Technologie basiertes Design und Charakterisierung von elektronischen Komponenten
Bösch, W., Hatab, Z., Gadringer, M. E., Takahashi, H., Maier, C., Sarbandi Farahani, H., Pauser, C., Paulitsch, H., Rezaee, B. & Fuchs, M.
1/11/20 → 31/10/27
Projekt: Forschungsprojekt

Dieses zitieren

@inproceedings{f6a0fcd7f5b24dedaa71e47dd4774b24,

title = "A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss",

abstract = "This study proposes an innovative design approach for layer transitions in printed circuit boards (PCBs) using microvia structures. Instead of treating microvias as vertical structures, we approached the analysis of microvias as a segment of a thick planar transmission line using quasi-TEM (transverse electromagnetic) analysis. The proposed design approach is shown to be effective for microstrip to embedded grounded coplanar waveguide (GCPW), microstrip to embedded microstrip, and microstrip to stripline transitions. The fabricated structures have been measured and show excellent return loss performance, achieving better than -15 dB for frequencies up to 150 GHz.",

keywords = "Microwave measurement, Waveguide transitions, Fabrication, Stripline, Printed circuits, Transmission line measurements, Microwave circuits, microwave measurement, microstrip, layer transition, printed circuit board, stripline",

author = "Ziad Hatab and Hiroaki Takahashi and Alterkawi, {Ahmad Bader Alothman} and Gadringer, {Michael Ernst} and Wolfgang B{\"o}sch",

year = "2023",

month = sep,

day = "21",

doi = "10.23919/EuMC58039.2023.10290259",

language = "English",

isbn = "979-8-3503-4739-5",

pages = "62--65",

booktitle = "2023 53rd European Microwave Conference, EuMC 2023",

publisher = "ACM/IEEE",

note = "53rd European Microwave Conference : EuMC 2023 ; Conference date: 19-09-2023 Through 21-09-2023",

}

TY - GEN

T1 - A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss

AU - Hatab, Ziad

AU - Takahashi, Hiroaki

AU - Alterkawi, Ahmad Bader Alothman

AU - Gadringer, Michael Ernst

AU - Bösch, Wolfgang

PY - 2023/9/21

Y1 - 2023/9/21

N2 - This study proposes an innovative design approach for layer transitions in printed circuit boards (PCBs) using microvia structures. Instead of treating microvias as vertical structures, we approached the analysis of microvias as a segment of a thick planar transmission line using quasi-TEM (transverse electromagnetic) analysis. The proposed design approach is shown to be effective for microstrip to embedded grounded coplanar waveguide (GCPW), microstrip to embedded microstrip, and microstrip to stripline transitions. The fabricated structures have been measured and show excellent return loss performance, achieving better than -15 dB for frequencies up to 150 GHz.

AB - This study proposes an innovative design approach for layer transitions in printed circuit boards (PCBs) using microvia structures. Instead of treating microvias as vertical structures, we approached the analysis of microvias as a segment of a thick planar transmission line using quasi-TEM (transverse electromagnetic) analysis. The proposed design approach is shown to be effective for microstrip to embedded grounded coplanar waveguide (GCPW), microstrip to embedded microstrip, and microstrip to stripline transitions. The fabricated structures have been measured and show excellent return loss performance, achieving better than -15 dB for frequencies up to 150 GHz.

KW - Microwave measurement

KW - Waveguide transitions

KW - Fabrication

KW - Stripline

KW - Printed circuits

KW - Transmission line measurements

KW - Microwave circuits

KW - microwave measurement

KW - microstrip

KW - layer transition

KW - printed circuit board

KW - stripline

UR - https://ieeexplore.ieee.org/document/10290259/

UR - http://www.scopus.com/inward/record.url?scp=85177597588&partnerID=8YFLogxK

U2 - 10.23919/EuMC58039.2023.10290259

DO - 10.23919/EuMC58039.2023.10290259

M3 - Conference paper

SN - 979-8-3503-4739-5

SP - 62

EP - 65

BT - 2023 53rd European Microwave Conference, EuMC 2023

PB - ACM/IEEE

T2 - 53rd European Microwave Conference

Y2 - 19 September 2023 through 21 September 2023

ER -

A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss

Abstract

Konferenz

ASJC Scopus subject areas

Fields of Expertise

Treatment code (Nähere Zuordnung)

Zugriff auf Dokument

Andere Dateien und Links

Fingerprint

Projekte

CD-Labor für Technologie basiertes Design und Charakterisierung von elektronischen Komponenten

Dieses zitieren