Characterization and Modeling of Sparkless Discharge to a Touch Screen Display

Jianchi Zhou, Cheung-Wei Lam, Zhekun Peng, Daryl Beetner, David Pommerenke

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandBegutachtung

Abstract

Although corona discharge to a touchscreen display is not associated with the spark, it could cause soft and hard failures due to electromagnetic coupling to sensitive electronics beneath the glass. Experimental data were obtained to characterize these sparkless discharges and an equivalent circuit model was constructed to predict the resulting coupling to touchscreen electronics. Measurements and simulation indicate that a thinner glass and a higher touchscreen indium-tin-oxide (ITO) sense trace impedance both lead to higher ESD risk by delivering higher energy into the sensing IC. A CST co-simulation model is proposed and is shown to model the displacement current accurately. Charge movement and dissipation on the glass surface is represented using a disk with conductivity proportional to the reciprocal of radial distance. Dust figure measurements were used to study the effects of the glass type, glass thickness and voltage level on the corona discharge and the current coupled to the touchscreen patch on the display. These results can be used to drive full wave co-simulation models which try to anticipate the impact of sparkless discharges on the touchscreen electronics.
Originalspracheenglisch
Titel2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
Herausgeber (Verlag)ACM/IEEE
Seiten510-515
Seitenumfang6
ISBN (elektronisch)9798350309768
ISBN (Print)979-8-3503-0977-5
DOIs
PublikationsstatusVeröffentlicht - 4 Aug. 2023
Veranstaltung2023 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC+SIPI 2023 - DeVos Place Convention Center, Grand Rapids, USA / Vereinigte Staaten
Dauer: 31 Juli 20234 Aug. 2023
https://emc2023.org/

Konferenz

Konferenz2023 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity
KurztitelEMC+SIPI 2023
Land/GebietUSA / Vereinigte Staaten
OrtGrand Rapids
Zeitraum31/07/234/08/23
Internetadresse

Schlagwörter

  • Surface impedance
  • Voltage measurement
  • Current measurement
  • Indium tin oxide
  • Glass
  • Touch sensitive screens
  • Conductivity

ASJC Scopus subject areas

  • Elektronische, optische und magnetische Materialien
  • Computational Mathematics
  • Sicherheit, Risiko, Zuverlässigkeit und Qualität
  • Signalverarbeitung
  • Instrumentierung
  • Strahlung
  • Elektrotechnik und Elektronik

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