CISPR 22: 1997 Conducted emission on telecom ports products pass/fail depending on test method

Ken Hall; David Pommerenke

CISPR 22: 1997 Conducted emission on telecom ports products pass/fail depending on test method

^*Korrespondierende/r Autor/-in für diese Arbeit

Publikation: Beitrag in einer Fachzeitschrift › Konferenzartikel › Begutachtung

Abstract

This paper analyzes test result differences for emissions testing in accordance with CISPR22: 1997. Emphasis is laid on unshielded twisted pair cables. It shows potential errors due to imbalance in coupling of the capacitive clamp to the wires of a differential pair and the influence of the common mode source impedance on current clamp and ISN measurements.

Originalsprache	englisch
Seiten (von - bis)	1-6
Seitenumfang	6
Fachzeitschrift	IEEE International Symposium on Electromagnetic Compatibility
Jahrgang	1
Publikationsstatus	Veröffentlicht - 1 Dez. 2001
Extern publiziert	Ja
Veranstaltung	2001 International Symposium on Electromagnetic Compatibility: EMC 2001 - Montreal, Kanada Dauer: 13 Aug. 2001 → 17 Aug. 2001

ASJC Scopus subject areas

Physik der kondensierten Materie
Elektrotechnik und Elektronik

Andere Dateien und Links

http://www.scopus.com/inward/record.url?scp=0035786779&partnerID=8YFLogxK

Dieses zitieren

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abstract = "This paper analyzes test result differences for emissions testing in accordance with CISPR22: 1997. Emphasis is laid on unshielded twisted pair cables. It shows potential errors due to imbalance in coupling of the capacitive clamp to the wires of a differential pair and the influence of the common mode source impedance on current clamp and ISN measurements.",

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AB - This paper analyzes test result differences for emissions testing in accordance with CISPR22: 1997. Emphasis is laid on unshielded twisted pair cables. It shows potential errors due to imbalance in coupling of the capacitive clamp to the wires of a differential pair and the influence of the common mode source impedance on current clamp and ISN measurements.

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JF - IEEE International Symposium on Electromagnetic Compatibility

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