Enhancement of the DPI method for IC immunity characterization

Andrea Lavarda, Bernd Deutschmann, Dieter Haerle

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Originalsprache	englisch
Titel	Proc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017)
Seiten	178-183
DOIs	https://doi.org/10.1109/EMCCompo.2017.7998106
Publikationsstatus	Veröffentlicht - 6 Juli 2017

ASJC Scopus subject areas

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title = "Enhancement of the DPI method for IC immunity characterization",

author = "Andrea Lavarda and Bernd Deutschmann and Dieter Haerle",

year = "2017",

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language = "English",

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booktitle = "Proc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017)",

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T1 - Enhancement of the DPI method for IC immunity characterization

AU - Lavarda, Andrea

AU - Deutschmann, Bernd

AU - Haerle, Dieter

PY - 2017/7/6

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U2 - 10.1109/EMCCompo.2017.7998106

DO - 10.1109/EMCCompo.2017.7998106

M3 - Conference paper

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EP - 183

BT - Proc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017)

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