Numerical simulation of hybrid joining processes: self-piercing riveting combined with adhesive bonding

  • Lukas Potgorschek (Contributor)
  • Domitner, J. (Speaker)
  • Florian Hönsch (Contributor)
  • Sommitsch, C. (Contributor)
  • Stefan Kaufmann (Contributor)

Activity: Talk or presentation › Talk at conference or symposium › Science to science

Period4 May 2020 → 8 May 2020
Event title23rd International Conference on Material Forming (ESAFORM 2020)
Event typeConference
LocationVirtual ConferenceShow on map
Degree of RecognitionInternational

Fields of Expertise

  • Advanced Materials Science