Numerical simulation of hybrid joining processes: self-piercing riveting combined with adhesive bonding

  • Lukas Potgorschek (Contributor)
  • Domitner, J. (Speaker)
  • Florian Hönsch (Contributor)
  • Sommitsch, C. (Contributor)
  • Stefan Kaufmann (Contributor)

Activity: Talk or presentationTalk at conference or symposiumScience to science

Period4 May 20208 May 2020
Event title23rd International Conference on Material Forming (ESAFORM 2020)
Event typeConference
LocationVirtual ConferenceShow on map
Degree of RecognitionInternational

Fields of Expertise

  • Advanced Materials Science