This paper deals with modeling and simulation of cable bundles for automotive EMC tests. A new stochastic cable bundle model is presented. The parameters of the model are grouped into parameters for geometry, simulation, and disorder. Using a particularly developed cable bundle testbench, the model is validated against measurements and the parameter dependencies are investigated. The parameter study shows that the model is governed by one universal constant which describes the stochastics of the cable bundle and a characteristic density which is directly related to the cable bundle geometry. Finally, the model is used in an exemplary EMC setup whose device under test is a partially populated printed circuit board of an automotive electronic control unit. The simulation agrees very well with the according real life measurement setup.
|Title of host publication||2010 Asia-Pacific International Symposium on Electromagnetic Compatibility|
|Publication status||Published - 2010|
|Event||2010 Asia-Pacific International Symposium on Electromagnetic Compatibility - Bejing, China|
Duration: 12 Apr 2010 → 16 Apr 2010
|Conference||2010 Asia-Pacific International Symposium on Electromagnetic Compatibility|
|Period||12/04/10 → 16/04/10|